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EPOXIBOND™ EB-109M-11

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

Product families

Ready-to-Use Products — Adhesives & Sealants
  • Encapsulants

Other characteristics

Brand
EPOXIBOND
Cure Method
Air Dry, Heat Cure
Product Type

2K (2 component) Adhesive, Adhesive, Encapsulant, Potting Compound; 2K (2 component) Adhesive; Adhesive; Encapsulant; Potting Compound

Application Area

Electronic Components, Measuring Instruments, Medical Applications, Optical Applications, Optoelectronics Devices, Semiconductors; Electronic Components; Measuring Instruments; Medical Applications; Optical Applications; Optoelectronics Devices; Semiconductors

Compatible Substrates & Surfaces
Glass, Metal, Plastics, Wood
Note

Typical Cured Properties After Recommended Cure : Tested at 25°C unless otherwise indicated

Markets
  • Consumer Goods
  • Electrical & Electronics
  • Healthcare & Pharma
  • Industrial
Features

Excellent impact/vibrations resistance.; Low stress adhesive for bonding optics inside OEM / scientific instruments

Shelf LIfe

1 Year (Two Parts Kit at 25°C), 1 Year (Frozen at -40°C)

Cure
  • Air Dry
  • Heat Cure
Availability
2 parts Kit
Packaged in Pint, Quart, Gallon, and 5- Gallon size.
Premixed and frozen
Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C.
Technology
Ready-to-Use Products
Frozen Adhesive

Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.

Curing
Recommended Cure
3 hrs at 65°C
Alternate Cure
24-48 hrs at 25°C
Safety Information

For Industrial Use Only : Practices of good housekeeping, safety and cleanliness should be followed before, during and after use. Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. Refer to Material Safety Data Sheet (MSDS) for additional health and safety information.

Use Instructions

Weigh each 100 grams of RESIN, EB-109M-11 to 30 grams of Hardener EH-21LP.; Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.; Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.; Typical cured properties were determined using recommended cure schedule.; Some difference in properties may occur with the alternate or other cure schedules.

Certifications and Compliance
  • ISO 9001
  • REACH (Europe)
  • RoHS Compliant
Ready to Use Product Features
  • Excellent Substrate Adhesion
  • Flexible
  • High Impact Resistance
  • Low Viscosity
  • Service Life Extension
  • Vibration Damping

Technical data

Table 1 of 2

11 rows
CharacteristicValueUnit
Specific Gravity1.16—
Hardness40 - 60Shore D
Water Absorption (24 hours Submersion at 25°C)max. 1%
Lap Shear Strength to Aluminiummax. 1000psi
Service Temperature Range-55 to 90°C
Glass Transition Temperature (Tg)max. 30°C
Coefficient of Linear Thermal Expansion (From -60°C to 25°C)min. 10010⁻⁶/°C
Dielectric Strength420Volts/mil
Dielectric Constant (at 1 kHz)3.8—
Dissipation Factor (at 1 kHz)0.012—
Volume Resistivity8x10¹⁴ohm-cm

Table 2 of 2

5 rows
CharacteristicValueUnit
AdhesiveEB-109M-11—
HardenerEH-21LP—
Mix Ratio by Weight (Adhesive/Hardener)100/30—
Mixed Viscosity (at 25°C)200 - 600cps
Pot Life (at 25°C, 100 grams)min. 4hours

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