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EPOXIBOND™ EB-119SP

EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents

Product families

Ready-to-Use Products — Adhesives & Sealants
  • Encapsulants
  • Structural Adhesives

Other characteristics

Brand
EPOXIBOND
Cure Method
Heat Cure
Product Type
  • 2K (2 component) Adhesive, Adhesive
  • 2K (2 component) Adhesive
  • Adhesive
Application Area

Electronic Components, Interconnect, Medical Applications, Medical Devices, Optical Applications, Optoelectronics Devices, Photonic Devices, Printed Electronics, Semiconductor Die Attach, Semiconductors, Sensors; Electronic Components; Interconnect; Medical Applications; Medical Devices; Optical Applications; Optoelectronics Devices; Photonic Devices; Printed Electronics; Semiconductor Die Attach; Semiconductors; Sensors

Compatible Substrates & Surfaces
Ceramic, Glass, Metal
Markets
  • Consumer Goods
  • Electrical & Electronics
  • Healthcare & Pharma
Cure
Heat Cure
Technology
Ready-to-Use Products
Frozen Adhesive

Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.

Safety Information
For Industrial Use Only
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
Warning
Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention. Refer to Material Safety Data Sheet (MSDS) for additional health and safety information.
Use Instructions

Weigh each 10 grams of RESIN (PART-A) to 1 gram of Hardener (PART-B).; Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.; Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.; Typical cured properties were determined using recommended cure schedule.

Technical data

Table 1 of 2

15 rows
CharacteristicValueUnit
Specific Gravity1.18—
Hardness87Shore D
Refractive Index1.56—
Spectral Transmission (at 800-1000 nm)min. 98%
Spectral Transmission (at 1100-1600 nm)min. 95%
Lap Shear Strength to Aluminium2200psi
Die Shear Strength (at 25°C)min. 5000psi
Service Temperature Range-55 to 250°C
Glass Transition Temperature (Tg)110°C
Coefficient of Linear Thermal Expansion (Below Tg)5410⁻⁶/°C
Coefficient of Linear Thermal Expansion (Above Tg)19010⁻⁶/°C
Dielectric Strength380Volts/mil

Table 2 of 2

3 rows
CharacteristicValueUnit
Mix Ratio by Weight (Adhesive/Hardener)100/10—
Mixed Viscosity (at 25°C)3000 - 5000cps
Pot Life (at 25°C, 100 grams)4 - 6hours

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