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Farboset® 2720
- Chemical Family
- Epoxy & Epoxy Derivatives
Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.
Properties
- Physical Form
- Granules
- Solid
Product families
Applications
Electrical & Electronics — Packaging & Assembly
- Potting Compounds
Electrical & Electronics — Parts & Components
- Other Parts & Components
Product Families
Plastics — Thermoset Resins
- Epoxies
Other characteristics
- Brand
- Farboset
- End Uses
Capacitors, Encapsulant, Resistor, Resistor Network
- Polymer Name
- Epoxy Resins & Compounds
- Color
- Gold
- Markets
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Fillers Included
- Mineral
- Material Features
- Fast Curing
- Good Moldability
- High Glass Transition Temperature
- High Moisture Resistance
- Low Odor
- Thermal Shock Resistant
- Certifications and Compliance
- ISO 9001
- UL 94
- Plastics and Elastomers End Uses
- Capacitors
- Encapsulant
- Resistor
- Resistor Network
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 4
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Filler | Mineral | — | — |
| Spiral Flow | 96.0 | cm | EMMI 1-66A |
| Hot Plate Cure Time (at 160°C) | 27 - 34 | seconds | — |
| Specific Gravity | 1.89 | — | — |
| Molded Density | 2.14 | gm/cc | — |
| Mold Shrinkage | 0.003 - 0.006 | cm/cm | — |
Table 2 of 4
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 17000.0 | psi |
| Flexural Modulus | 2.0x 10⁶ | psi |
| Compressive Strength | 35000.0 | psi |
| Tensile Strength | 11000.0 | psi |
Table 3 of 4
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Glass Transition Temperature (Tg) | 155.0 | °C |
| Linear Thermal Expansion (Alpha 1) | 25x 10⁻⁶ | cm/cm/°C |
| Linear Thermal Expansion (Alpha 2) | 77x 10⁻⁶ | cm/cm/°C |
Table 4 of 4
2 rows| Characteristic | Value |
|---|---|
| Dielectric Constant (at 1 KHz/1 MHz, Wet) | 4.2-4.5 |
| Dissipation Factor (1KHz/1MHz, Wet) | 0.011/0.0124 |
