Farboset® 2460
- Chemical Family
- Epoxy & Epoxy Derivatives
Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.
Product families
Applications
- Potting Compounds
- Other Parts & Components
Product Families
- Epoxies
Other characteristics
- Brand
- Farboset
- End Uses
Capacitors, Coils, Encapsulant, Resistor, Resistor Network
- Polymer Name
- Epoxy Resins & Compounds
- Flexural Strength
- 1372.0 - 1372.0 MPa
- Volume Resistivity
- 18000000000000.0 - 18000000000000.0 Ohm-m
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Fillers Included
- Mineral
- Material Features
- Fast Curing
- Good Moldability
- High Glass Transition Temperature
- High Moisture Resistance
- High Performance
- Low Odor
- Thermal Shock Resistant
- Applications
This compound was especially formulated for improved resistance to moisture ingress along with a high glass transition temperature for optimum reliability performance. It is designed to encapsulate a wide range of devices including tantalum and ceramic capacitors, resistors, resistor networks and high performance coils.
- Certifications and Compliance
- ISO 9001
- UL 94
- Plastics and Elastomers End Uses
- Capacitors
- Coils
- Encapsulant
- Resistor
- Resistor Network
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 4
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 14000 | kg/cm² |
| Flexural Strength | 985 | psi |
| Compressive Strength | 26000 | kg/cm² |
| Compressive Strength | 1830 | psi |
| Tensile Strength | 9000 | kg/cm² |
| Tensile Strength | 630 | psi |
Table 2 of 4
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Glass Transition Temperature (Tg) | 169 | °C |
| Linear Thermal Expansion (Alpha 1) | 39x 10⁻⁶ | cm/cm/°C |
| Linear Thermal Expansion (Alpha 2) | 30x 10⁻⁶ | cm/cm/°C |
| Hot Plate Cure Time (at 150 °C) | 25 | seconds |
| Thermal Conductivity | 30x10⁻⁴ | cal/cm-sec-°C |
Table 3 of 4
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant (1 MHz) | 4.2 | — | — |
| Dielectric Constant (60 Hz) | 4.4 | — | — |
| Dissipation Factor (60 Hz) | 0.004 | — | ASTM 150 |
| Dissipation Factor (1 MHz) | 0.013 | — | ASTM 150 |
| Dissipation Factor (10 KHz) | 0.012 | — | ASTM 150 |
| Dielectric Constant (10 KHz) | 4.3 | — | — |
| Dielectric Strength (Short Time, 125 mils) | 300 | volts/mil | — |
| Volume Resistivity | 1.8 x 10¹⁵ | Ohm - cm | — |
Table 4 of 4
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Bulk Density | 1 | gm/cc | — |
| Molding Pressure | 14 - 70 | kg/cm² | — |
| Molding Pressure | 200 - 1,000 | psi | — |
| Molding Temperature | 145 - 180 | °C | — |
| Molding Temperature | 293 - 356 | °F | — |
| Mold Shrinkage | 0.005 | cm/cm | — |
| Cure Time (at 150°C) | 1 - 2 | minutes | — |
| Molded Density | 2.03 | gm/cc | — |
| Spiral Flow | 89 | cm | EMMI 1-66A |
