Cosmic Epoxy E4930R
- Chemical Family
- Epoxy & Epoxy Derivatives
Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.
Properties
- Physical Form
- Granules
- Solid
Product families
- Epoxies
Other characteristics
- Brand
- Cosmic Epoxy
- End Uses
Capacitors, Encapsulant, Optocoupler, Resistor, Transistor
- Polymer Name
- Epoxy Resins & Compounds
- Flexural Strength
- 103.35 - 103.35 MPa
- Volume Resistivity
- 10000000000000.0 - 10000000000000.0 Ohm-m
- Markets
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Key Features
It has excellent moisture resistance and thermal cycling stability.; Standard spiral flow range is 30-40" (EMMI) at 160 0C and 1000 psi, and a flow duration of 40-50 seconds at 325 - 1000 psi.; It has a hot plate gel time of 35-45 seconds at 160 0C.
- Technology
- Plastics
- Fillers Included
- Mineral
- Material Features
- Excellent Moisture Resistance
- Good Thermal Stability
- Low Odor
- Applications
Used to encapsulate optocouplers, capacitors, resistors, resistor networks, transistors, SOIS's and QFP.
- Certifications and Compliance
- ISO 9001
- UL 94
- Plastics and Elastomers End Uses
- Capacitors
- Encapsulant
- Optocoupler
- Resistor
- Transistor
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 5
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 15000 | psi |
| Flexural Modulus | 2.0 x 10⁶ | psi |
| Compressive Strength | 28000 | psi |
| Tensile Strength | 12000 | psi |
| Impact Strength (Izod Notched) | 0.6 | ft-lb / inch |
| Barcol Hardness | 65 | — |
Table 2 of 5
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Heat Deflection Temperature | 260 | °C |
| Glass Transition Temperature (Tg) | 165 | °C |
| Coefficient of Linear Expansion (Alpha 1) | 25 x 10⁻⁶ | °C |
| Coefficient of Linear Expansion (Alpha 2) | 80 x 10⁻⁶ | °C |
| Thermal Conductivity | 30 x 10⁻⁴ | cal/sec/cm²/°C/cm |
Table 3 of 5
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Arc Resistance | 180 | seconds |
| Volume Resistance | 1 x 10¹⁵ | Ohm - cm |
| Surface Resistance | 1 x 10¹⁵ | Ohm - cm |
| Dielectric Strength (Kv Step-by-Step, Wet) | 350 | volts/mil |
| Dielectric Breakdown (Step-by-Step, Wet) | 56 | Kv |
| Dielectric Constant (at 1 KHz, Wet) | 4.2 | — |
| Dissipation Factor (at 1KHz, Wet) | 0.012 | — |
| Dielectric Constant (at 1 MHz, Wet) | 4.5 | — |
| Dissipation Factor (at 1MHz, Wet) | 0.011 | — |
Table 4 of 5
1 row| Characteristic | Value | Unit |
|---|---|---|
| Water Absorption (at 50 °C,48 hours) | 0.25 | % |
Table 5 of 5
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.85 | — |
| Bulk Factor | 2 - 5 | — |
| Molding Pressure | 500 - 8,000 | psi |
| Molding Temperature | 150 - 180 | °C |
| Mold Shrinkage | 0.002 - 0.004 | In / In |
