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Cosmic Epoxy E4930R

Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.

Properties

Physical Form
  • Granules
  • Solid

Product families

Plastics — Thermoset Resins
  • Epoxies

Other characteristics

Brand
Cosmic Epoxy
End Uses

Capacitors, Encapsulant, Optocoupler, Resistor, Transistor

Polymer Name
Epoxy Resins & Compounds
Flexural Strength
103.35 - 103.35 MPa
Volume Resistivity
10000000000000.0 - 10000000000000.0 Ohm-m
Markets
Electrical & Electronics
Flame Rating
UL 94 V0
Key Features

It has excellent moisture resistance and thermal cycling stability.; Standard spiral flow range is 30-40" (EMMI) at 160 0C and 1000 psi, and a flow duration of 40-50 seconds at 325 - 1000 psi.; It has a hot plate gel time of 35-45 seconds at 160 0C.

Technology
Plastics
Fillers Included
Mineral
Material Features
  • Excellent Moisture Resistance
  • Good Thermal Stability
  • Low Odor
Applications

Used to encapsulate optocouplers, capacitors, resistors, resistor networks, transistors, SOIS's and QFP.

Certifications and Compliance
  • ISO 9001
  • UL 94
Plastics and Elastomers End Uses
  • Capacitors
  • Encapsulant
  • Optocoupler
  • Resistor
  • Transistor
Plastics and Elastomers Functions
Resin

Technical data

Table 1 of 5

6 rows
CharacteristicValueUnit
Flexural Strength15000psi
Flexural Modulus2.0 x 10⁶psi
Compressive Strength28000psi
Tensile Strength12000psi
Impact Strength (Izod Notched)0.6ft-lb / inch
Barcol Hardness65—

Table 2 of 5

5 rows
CharacteristicValueUnit
Heat Deflection Temperature260°C
Glass Transition Temperature (Tg)165°C
Coefficient of Linear Expansion (Alpha 1)25 x 10⁻⁶°C
Coefficient of Linear Expansion (Alpha 2)80 x 10⁻⁶°C
Thermal Conductivity30 x 10⁻⁴cal/sec/cm²/°C/cm

Table 3 of 5

9 rows
CharacteristicValueUnit
Arc Resistance180seconds
Volume Resistance1 x 10¹⁵Ohm - cm
Surface Resistance1 x 10¹⁵Ohm - cm
Dielectric Strength (Kv Step-by-Step, Wet)350volts/mil
Dielectric Breakdown (Step-by-Step, Wet)56Kv
Dielectric Constant (at 1 KHz, Wet)4.2—
Dissipation Factor (at 1KHz, Wet)0.012—
Dielectric Constant (at 1 MHz, Wet)4.5—
Dissipation Factor (at 1MHz, Wet)0.011—

Table 4 of 5

1 row
CharacteristicValueUnit
Water Absorption (at 50 °C,48 hours)0.25%

Table 5 of 5

5 rows
CharacteristicValueUnit
Specific Gravity1.85—
Bulk Factor2 - 5—
Molding Pressure500 - 8,000psi
Molding Temperature150 - 180°C
Mold Shrinkage0.002 - 0.004In / In

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