Creative Materials 125-22
B-STAGE PROCEDURE125-22 is a screen-printable, B-Stageable, electrically conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 125-22 is designed to exhibit minimal flow during bonding. This product provides superior electrical and thermal conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form.\nFeatures
Product families
Applications
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Cure Method
- Heat Cure
- Product Type
1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 1K (1 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Application Area
- Electrical Components
- Application Method
- Injection, Screen Coating
- Compatible Substrates & Surfaces
- Aluminum, Ceramic, Copper, Metal
- Markets
- Electrical & Electronics
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Procedure
Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when cooled to room temperature. A temperature of 100°C to 120°C for 5 to 15 minutes is required, B-Stage time is mass related. User is encouraged to experiment for optimum drying time at a given temperature.
- Bonding Procedure
To use, apply b-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain location. Cure for 15 minutes at 200°C, or 30 minutes at 175°C, or 1 hour at 160°C. For better adhesion of the bstaged film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing should start after adhesive and substrates reach curing temperature.
- Curing Guidelines
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
- Application Methods
- Injection
- Screen Coating
- Handling
Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful not entrap air while mixing. 125-22 can be thinned with small amounts of CMI# 113-12 (fast drying), or #102-03 (slow drying) thinners.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Chemical Resistant
- Electrically Conductive
- Excellent Flexibility
- Good Thermal Conductivity
- Good Thermal Stability
- High Temperature Resistance
- Long Screen Life
- Low Thermal Expansion
- Compatible Substrates and Surfaces
- Aluminum
- Ceramic
- Copper
- Metal
Technical data
Table 1 of 3
2 rows| Characteristic | Value |
|---|---|
| Pot Life | Latent |
| Conductivity | 0.001 |
Table 2 of 3
8 rows| Characteristic | Value | Unit |
|---|---|---|
| Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C) | 20,000 - 30,000 | cps |
| Specific Gravity | 1.88 | g/cc |
| Theoretical Coverage (at 0.001" Thickness) | approx. 30 | in^2 |
| Screen Life | min. 8 | hrs |
| Filler | Silver | — |
| Volume Resistivity | max. 0.001 | Ω - cm |
| Thermal Conductivity | 6.5 | W/mK |
| Percent Silver (cured) | 60 | — |
Table 3 of 3
7 rows| Characteristic | Value | Unit |
|---|---|---|
| Thermal Stability | Good to 325 | °C |
| Useful Temperature Range | 55 to 230 | ºC |
| Glass Transition Temperature (Tg) | 150 | ºC |
| Coefficient of Thermal Expansion below Tg | 50 x 10^-6 | in/in/°C |
| Coefficient of Thermal Expansion above Tg | 60 x 10^-6 | in/in/ºC |
| Tensile Shear Strength | min. 2000 | Psi |
| Peel Strength (Copper to copper at 90°) | 9 | Pli |
