Creative Materials 111-27
111-27 is an electrically insulating coating and encapsulant suitable for application by spraying, dipping, syringe dispensing, pouring, and screen printing. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing when used as a coating. Some applications for 111-27 include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, environmental and humidity protection of surface mount components, insulating and diffusive layers of LEDs, and membrane switches. 111-27 also protects components from moisture, salts, and abrasion and features a high surface hardness with good toughness which reduces the risk of stress-fracturing bonded components. 111-27 is suitable for UV inspection.
Properties
- Physical Form
- Liquid
Product families
Applications
- Electronics Coatings
- Semiconductor Manufacturing
Product Families
- Encapsulants
- Protective Coatings
Other characteristics
- Product Type
- Encapsulant, Insulating Coating
- Encapsulant
- Insulating Coating
- Application Area
Electrical Components, Flexible Circuits, LEDs, Membrane Touch Switch; Electrical Components; Flexible Circuits; LEDs; Membrane Touch Switch
- Application Method
Dip Coating, Injection, Pour, Screen Coating, Spray
- Compatible Substrates & Surfaces
- Glass, Plastics, Polyimide
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months at 21°C
- Technology
- Ready-to-Use Products
- Suggested Curing
111-27 features a quick setup time at elevated temperatures but also can be cured at ambient temperatures. For good, cured properties one of the following cure schedules will be a good starting profile but end user is advised to experimentally determine temperature and time best suited for individual applications.; 25°C (@30- 50% RH); 25°C (@30 50% RH); *1-When used as an encapsulant bubbles may form using 130°C cure
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Dip Coating
- Injection
- Pour
- Screen Coating
- Spray
- Suggested Handling
111-27 can be used as-is but further thinning for spray and/or dip coating may be accomplished by adding MEK or acetone for faster drying or xylene or 127-22 for slower drying. Thinned material should be used within 12 - 16 hours.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Abrasion Resistant
- Creasing Resistance
- Electrically Insulating
- Excellent Dielectric Properties
- Excellent Moisture Resistance
- Excellent Substrate Adhesion
- Excellent Toughness
- Flexing Resistance
- Compatible Substrates and Surfaces
- Glass
- Plastics
- Polyimide
Technical data
Table 1 of 3
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Optical Transmission | High | — |
| Fungus Resistance | Non-nutrient | — |
| Useful Temperature Range | -55 to 110 | ºC |
| Thermal Stability | 200 | °C |
Table 2 of 3
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Insulation Resistance Cycle 1 (1 to 3 mil film, 25°C, 50% R.H.) | 1 x 10^15 | ohms |
| Insulation Resistance Cycle 4 (1 to 3 mil film, 65°C, 95% R.H) | 4 x 10^10 | ohms |
| Insulation Resistance Cycle 7 (1 to 3 mil film, 65°C, 95% R.H.) | 5 x 10^10 | ohms |
| Insulation Resistance Cycle 10 (1 to 3 mil film, 65°C, 95% R.H.) | 2 x 10^10 | ohms |
| Insulation Resistance Cycle 10 (1 to 3 mil film, 25°C, 50% R.H., after 24 hours) | 2 x 10^13 | ohms |
| Leakage Rate (Before thermal shock, microamperes) | max. 10 | — |
| Leakage Rate (After thermal shock, microamperes) | max. 10 | — |
| Volume Resistivity | 1.1 x 10^14 | ohm-cm |
| Dielectric strength | 1300 | volts/mil |
| Dissipation Factor (100 Hz) | 0.011 | — |
| Dielectric Constant (at 100 Hz) | 4.1 | — |
| Chloride | max. 40 | ppm |
Table 3 of 3
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Tensile Modulus (-40°C) | 4000 | MPa |
| Tensile Modulus (+25°C) | 2000 | MPa |
| Tensile Modulus (+80°C) | 670 | MPa |
| Glass Transition Temperature | 103 | °C |
| Coefficient of Thermal Expansion | 100 | ppm/°C |
| Hardness (at 25°C cure) | 55 | Shore D |
