Creative Materials 124-07-F
- Chemical Family
- Epoxy & Epoxy Derivatives
124-07-F is a B-staged, one part epoxy coating and laminating adhesive film. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. This product is available in thicknesses from 1 to 5 mils.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
- Printed Circuit Boards (PCBs)
Product Families
- Other Adhesives & Sealants
Other characteristics
- Product Type
1K (1 component) Adhesive, Epoxy Adhesive, Epoxy Coating; 1K (1 component) Adhesive; Epoxy Adhesive; Epoxy Coating
- Application Area
- Printed Circuit Boards
- Markets
- Consumer Goods
- Electrical & Electronics
- Shelf LIfe
- 6 Months -10°C
- Technology
- Ready-to-Use Products
- Curing Guidelines
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
- Handling
This product is shipped frozen and should be stored frozen to optimize shelf life. Care should be taken in handling frozen/cold sheets, they are more likely to crack at this point (avoid flexing film if stored at - 40°C). Allow material to warm to room temperature before handling.
- General Description
- Adhesive Thickness (mils)
- Substrate Type: PET Release Liner
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Chemical Resistant
- Good Coating Performance
- Good Thermal Stability
- Thermal Cycle Resistance
- Application Procedure
To ensure a good bond, the bonding surfaces should be free of any contaminants such as oils, greases, fingerprints, etc. 1. Remove the film from cold storage and allow it to warm to room temperature. 2. After the film has been warmed to room temperature, remove release liner from one side. 3. Preheat substrate to 50°C to 70°C. 4. Locate the adhesive onto the preheated substrate. Smooth out any trapped air by hand, with a roller or any other smoothing device. Some pressure is advisable to ensure intimate contact between the adhesive and substrate. 5. Allow the substrate to cool to room temperature (cooler is better) and remove release liner. This is very important to allow for easy and clean separation of the final release liner from the adhesive. 6. Place the two substrates to be bonded together under uniform pressure. It is advisable to preheat the devise(s) being used to apply pressure. An unheated device will result in longer cure times and less uniformity of cure. 7. Cure at the desired cure schedule. Refer to the cure schedules above for guide information
Technical data
Table 1 of 1
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Glass Transition Temperature | 105 | °C |
| Lap Shear Strength | 2100 | psi |
| Dielectric Strength | 425 | (volts/mil) |
| Volume Resistivity | 1x 1016 | Ω - cm |
| Dielectric Constant (at 100 Hz) | 4 | — |
| Useful Temperature Range | -55 to 230 | ºC |
| Thermal Stability | Good to 325 | °C |
| Coefficient of Thermal Expansion below Tg | 29.5 x 10^5 | in/in/°C |
| Coefficient of Thermal Expansion above Tg | 13.5 x 10^5 | in/in/°C |
