Creative Materials 125-22-F
- Chemical Family
- Epoxy & Epoxy Derivatives
125-22-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. Some applications for 125-22-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the Bstaged form. This product is available in thicknesses from 1 to 5 mils\nFeatures\nExcellent Electrical Conductivity
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Adhesives & Sealants
- Conduits & Cable Management
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
- Conductive Adhesive
- Application Area
Electrical Components, PTF Circuits, Ribbon Cables; Electrical Components; PTF Circuits; Ribbon Cables
- Markets
- Consumer Goods
- Electrical & Electronics
- Shelf LIfe
- 1 month at 25°C or 3 months at -10°C.
- Technology
- Ready-to-Use Products
- Handling
This product is shipped frozen and should be stored frozen to optimize shelf life. Care should be taken in handling frozen/cold sheets, they are more likely to crack at this point (avoid flexing film if stored at -40°C). Allow material to warm to room temperature before handling. Please refer to Applying/Transfer Procedure for more details.
- General Description
Substrate Type: PET Release Liner Conductive Coating Type: Silver/Polymer; Adhesive Thickness (mils)
- Application Procedure
To ensure a good bond, the bonding surfaces should be free of any contaminants such as oils, greases, fingerprints, etc. 1. Remove the film from cold storage and allow it to warm to room temperature. 2. After the film has been warmed to room temperature, remove release liner from one side. 3. Preheat substrate to 50°C to 70°C. 4. Locate the adhesive onto the preheated substrate. Smooth out any trapped air by hand, with a roller or any other smoothing device. Some pressure is advisable to ensure intimate contact between the adhesive and substrate. 5. Allow the substrate to cool to room temperature (cooler is better) and remove release liner. This is very important to allow for easy and clean separation of the final release liner from the adhesive. 6. Place the two substrates to be bonded together under uniform pressure. It is advisable to preheat the devise(s) being used to apply pressure. An unheated device will result in longer cure times and less uniformity of cure. 7. Cure at the desired cure schedule. Refer to the cure schedules above for guide information.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Chemical Resistant
- Electrically Conductive
- Good Thermal Stability
- High Temperature Performance
Technical data
Table 1 of 1
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Volume Resistivity | 0.001 | Q-cm |
| Thermal Conductivity | 6.5 | WimK |
| Operating Temperature | -55 to 230 | °C |
| Peak Temperature | 325 | °C |
| Glass Transition Temperature (Tg) | 150 | °C |
| Coefficient of Thermal Expansion below Tg | 50x 10^-6 | In/in/C |
| Coefficient of Thermal Expansion above Tg | 60 x 10^-6 | In/in/C |
| T-Shear Strength | min. 2000 | psi |
| Peel Strength (Copper to copper at 90°) | 9 | Pli |
