Creative Materials 122-07-F
- Chemical Family
- Epoxy & Epoxy Derivatives
122-07-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 122- 07-F include, but are not limited to, die attach bonding, circuit board fabrication, advanced material composites, sealing, and high performance coatings. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils.\nFeatures\nExcellent Thermal Conductivity
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
- Semiconductor Manufacturing
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
- Conductive Adhesive, Epoxy Adhesive
- Conductive Adhesive
- Epoxy Adhesive
- Application Area
- Semiconductors
- Markets
- Consumer Goods
- Electrical & Electronics
- Shelf LIfe
- 6 Months -10°C
- Technology
- Ready-to-Use Products
- Curing Guidelines
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
- Handling
This product is shipped frozen and should be stored frozen to optimize shelf life. Care should be taken in handling frozen/cold sheets, they are more likely to crack at this point (avoid flexing film if stored at -40°C). Allow material to warm to room temperature before handling.
- General Description
- Adhesive Thickness (mils)
- Substrate Type: PET Release Liner
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Chemical Resistant
- Good Coating Performance
- Good Thermal Stability
- High Temperature Performance
- Low Ionic Strength
- Thermally Conductive
Technical data
Table 1 of 2
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Chloride | max. 10 | ppm |
| Sodium Content | max. 10 | ppm |
| Potassium Content | max. 10 | ppm |
Table 2 of 2
11 rows| Characteristic | Value | Unit |
|---|---|---|
| Thermal Conductivity | 5.5 | W/mK |
| Operating Temperature | -55 to +230 | °C |
| Peak Temperature | 325 | °C |
| Volume Resistivity | 1x 10 | Q-cm |
| Glass Transition Temperature | 100 | °C |
| Coefficient of Thermal Expansion below Tg | 29.5 x 10 | In/in/°C |
| Coefficient of Thermal Expansion above Tg | 13.5 x 10 | In/in/°C |
| T-Shear Strength | min. 2100 | psi |
| Weight Loss (at 300°C, TGA) | 2.98 | % |
| Dielectric Constant (at 1 Hz) | 5.2 | — |
| Dielectric Factor (60 Hz) | 0.018 | — |
