Creative Materials 124-19C119-44
- Chemical Family
- Epoxy & Epoxy Derivatives
124-19C119-44 is a pre-catalyzed, low temperature curing, silver-filled epoxy adhesive. 124- 19C119-44 is designed to be used for making electrical and mechanical attachments of electrical components and devices, when shorts between closely spaced contact pads are a concern. 124-19C119-44 provides for electrical conductivity in the Z-axis while remaining electrically insulating in the X-axis and Y-axis and maintaining a 0.0005-inch bondline. Unlike typical heat curing systems, this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.\nFeatures
Product families
- Conductive Adhesives
Other characteristics
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Application Area
- Electrical Components
- Application Method
- Injection
- Shelf LIfe
- 6 months at -40°C, max. 4 days at 25°C
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Suggested Curing
Best properties, for most applications, result when cured following one of the following cure schedules under pressure but good results can be attained with temperatures between 80° and 200°C. End user is advised to experimentally determine temperature and time best suited for individual applications though higher temperatures are recommended for highest mechanical strength.
- Safety and Handling
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove from skin. For recommended application and handling information please review the Anisotropic Conductive Adhesive Guidelines.
- Application Methods
- Injection
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Electrically Conductive
- Good Bonding Strength
- Low Temperature Curing
Technical data
Table 1 of 2
1 row| Characteristic | Value | Unit |
|---|---|---|
| Minimum Cure Temperature | 100 | °C |
Table 2 of 2
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Volume Resistivity (Z Axis) | max. 0.001 | Ω - cm |
| Volume Resistivity (X and Y Axis) | max. 1x 10^12 | Ω - cm |
| Recommended Pad Size | min. 200 | µm |
| Recommended Pad Spacing | min. 50 | µm |
| Water Absorption | max. 0.06 | % |
| Specific Gravity | 1.23 | — |
| Lap Shear Strength (100°C cure) | min. 1,200 | psi |
| Lap Shear Strength (150°C cure) | min. 1,800 | psi |
| Young's Modulus | 12 | GPa |
| Solvent Resistance | Excellent | — |
| Useful Temperature Range | -55 to 225 | ºC |
| Thermal Stability | Good to 250 | °C |
