Creative Materials 125-22C119-44
125-22C119-44 is a screen-printable, B-Stageable, electrically conductive, one-part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 125-22C119-44 is designed to exhibit minimal flow during bonding. This product provides superior electrical and thermal conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form. 125-22C119-44 is 125-22 with 2% by weight B119-44 added for reduced cure times and temperatures.
Product families
- Conductive Adhesives
Other characteristics
- Cure Method
- Heat Cure
- Product Type
1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 1K (1 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Application Area
- Electrical Components
- Application Method
- Injection, Screen Coating
- Compatible Substrates & Surfaces
- Aluminum, Ceramic, Copper, Metal
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Procedure
Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when cooled to room temperature. A temperature of 70 – 85°C for 5 to 15 minutes is required, B-Stage time is mass related. User is encouraged to experiment for optimum drying time at a given temperature. For increased surface adhesion to some substrates CMI 126-39 can be used.
- Bonding Procedure
To use, apply B-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain location. Cure at one of the above cure schedules. For better adhesion of the b-staged film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing should start after adhesive and substrates reach curing temperature.
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Injection
- Screen Coating
- Curing
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
- Handling
Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful not entrap air while mixing. 125-22C119-44 can be thinned with small amounts of CMI 113-12 (fast drying), or 102- 03 (slow drying) thinners.
- Certifications and Compliance
- ISO 14001
- ISO 9001
- Ready to Use Product Features
- Chemical Resistant
- Electrically Conductive
- Excellent Flexibility
- Good Thermal Conductivity
- Good Thermal Stability
- High Temperature Resistance
- Long Screen Life
- Low Thermal Expansion
- Compatible Substrates and Surfaces
- Aluminum
- Ceramic
- Copper
- Metal
Technical data
Table 1 of 3
2 rows| Characteristic | Value |
|---|---|
| Pot Life | Latent |
| Conductivity | 0.001 |
Table 2 of 3
8 rows| Characteristic | Value | Unit |
|---|---|---|
| Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C) | 20,000 - 30,000 | cps |
| Specific Gravity | 1.88 | g/cc |
| Theoretical Coverage (at 0.001" Thickness) | approx. 30 | in^2 |
| Screen Life | min. 8 | hrs |
| Filler | Silver | — |
| Volume Resistivity | max. 0.001 | Ω - cm |
| Thermal Conductivity | 6.5 | W/mK |
| Percent Silver (cured) | min. 60 | — |
Table 3 of 3
7 rows| Characteristic | Value | Unit |
|---|---|---|
| Thermal Stability | Good to 325 | °C |
| Useful Temperature Range | -55 to 230 | ºC |
| Glass Transition Temperature (Tg) | 150 | ºC |
| Coefficient of Thermal Expansion below Tg | 50 x 10^-6 | in/in/°C |
| Coefficient of Thermal Expansion above Tg | 60 x 10^-6 | in/in/ºC |
| Tensile Shear Strength | min. 2000 | Psi |
| Peel Strength (Copper to copper at 90°) | 9 | Pli |
