Creative Materials F940A/B-187
- Chemical Family
- Epoxy & Epoxy Derivatives
F940 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. Use B-187 when long pot life and higher heat resistance is desired.\nFeatures\nLow viscosity with long pot life.\nRequires mild heat cure.
Product families
Applications
- Potting Compounds
Product Families
- Encapsulants
Other characteristics
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Color
- Black
- Markets
- Electrical & Electronics
- Appearance
- Amber, Black
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Curing
- 30 mins @ 100°C
- Mixing Instructions
Premix Part A in original container prior to adding curing agent. Add Part B to Part A and mix until uniform. Use with Part B-187 when high temperature performance is desired. NOTE: It is not unusual for crystallization of the B-187 to occur. Warm to 40-45°C in a water bath to return the material to it's original viscosity. The crystallization of the catalyst does not effect the performance of the product in any way. To prevent recrystallization, store the B-187 at temperatures between 35-45°C.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Heat Resistance
- Long Potlife
- Low Viscosity
- Pinhole-Free
Technical data
Table 1 of 4
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 7500 | cps |
| Mix Ratio (by weight) | 100 | — |
Table 2 of 4
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | 4 hours | — |
| Pot Life | min. 4 Hrs | — |
| Viscosity | 3000 | cps |
Table 3 of 4
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 500 | cps |
| Mix Ratio (by weight) | 3 | — |
Table 4 of 4
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.51 | — |
| Hardness | 85 | Shore D |
| Coefficient of Thermal Expansion | 22 | in/in °C x 10^-6 |
| Thermal Conduction | 1.28 | W/m-K |
| Cure Shrinkage | 0.189 | % |
| Heat Distortion Temperature | 115 | °C |
| Tensile Strength | 9600 | psi |
| Water Absorption | max. 0.22 | % |
| Dielectric Strength | 475 | volts/mil |
| Volume Resistivity | 1x 10^15 | Ω - cm |
| Power Factor (60 HZ) | 0.028 | — |
| Dielectric Constant (60 HZ) | 4.3 | — |
