Creative Materials F947A/B-187
- Chemical Family
- Epoxy & Epoxy Derivatives
F-947 is a black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. When used with curing agent B-187, cured product retains mechanical and electrical properties at operating temperatures up to 155°C.\nFeatures\nExcellent heat resistance\nExtended pot life.
Product families
Applications
- Potting Compounds
Product Families
- Encapsulants
Other characteristics
- Cure Method
- Air Dry, Heat Cure
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Color
- Black
- Markets
- Electrical & Electronics
- Appearance
- Amber, Black
- Cure
- Air Dry
- Heat Cure
- Technology
- Ready-to-Use Products
- Mixing Instructions
Premix Part A in original container prior to adding curing agent. Add Part B187 to Part A and mix until uniform. NOTE: It is not unusual for crystallization of the B-187 to occur. Warm to 40-45°C in a water bath to return the material to it's original viscosity. The crystallization of the catalyst does not effect the performance of the product in any way. To prevent recrystallization, store the B-187 at temperatures between 35-45°C.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Heat Resistance
- Long Potlife
- Pinhole-Free
Technical data
Table 1 of 4
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 55000 | cps |
| Mix Ratio (by weight) | 100 | — |
Table 2 of 4
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | 4 hours | — |
| Viscosity | 5000 | cps |
Table 3 of 4
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 300 | cps |
| Mix Ratio (by weight) | 12 | — |
Table 4 of 4
13 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.49 | — |
| Hardness | min. 85 | Shore D |
| Coefficient of Thermal Expansion | 22 | in/in °C x 10^-6 |
| Thermal Conduction | 1.28 | W/m-K |
| Cure Shrinkage | 0.189 | % |
| Heat Distortion Temperature (with B-187) | 148 | °C |
| Fungus Resistance | Non-nutrient | — |
| Tensile Strength | 9600 | psi |
| Water Absorption | max. 0.22 | % |
| Dielectric Strength | 475 | volts/mil |
| Volume Resistivity | 1x 10^15 | Ω - cm |
| Power Factor (60 HZ) | 0.028 | — |
