Creative Materials 118-06(SP)
118-06(SP) is a screen-printable, B-Stage able, electrically conductive, one part epoxy coating and adhesive. 118- 06(SP) can also be applied by dipping and syringe dispensing. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include, but are not limited to assembling electrical and electronic components.\nFeatures\nExcellent Electrical Conductivity\nOutstanding Printability
Product families
Applications
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Cure Method
- Heat Cure
- Product Type
1K (1 component) Adhesive, 1K (1 component) Coating, Conductive Adhesive, Epoxy Adhesive, Epoxy Coating; 1K (1 component) Adhesive; 1K (1 component) Coating; Conductive Adhesive; Epoxy Adhesive; Epoxy Coating
- Application Area
- Electrical Components
- Application Method
- Dip Coating, Injection, Screen Coating
- Markets
- Electrical & Electronics
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Procedure
Apply adhesive to substrate. Apply heat to advance curing to the non-tacky stage (when cooled to room temperature). A temperature of 125º C for 2 – 3 minutes is required (B-stage time is mass related). The user is encouraged to experiment for optimum drying time at a given temperature. Store on release liner to prevent contamination.
- Bonding Procedure
As with all adhesive bonds, surface preparation is a vital part of the process. Carefully clean both surfaces to be bonded with MEK if possible. If MEK is not compatible with the surfaces to be bonded, another suitable solvent may be used.; Allow cleaned surfaces to dry completely.; Die cut 118-06(SP) to the of the size of interface area, remove one of the protective liners, position onto one of the surfaces to be bonded, and warm the substrate/adhesive to 50°C-70°C. By applying slight pressure, laminate the film/adhesive to the substrate smoothing out any trapped air. Allow to cool to room temperature and peel off the other release liner.; Position the other substrate and apply a clamp to provide constant pressure.; Cure for 1 hour at 150°C.; Remove pressure. Part is ready for use
- Curing Guidelines
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Dip Coating
- Injection
- Screen Coating
- Handling
118-06(SP) is a one component epoxy system and is ready to use as received. Product should be stored frozen to maintain consistent flow properties. Allow 118-06(SP) to warm up to room temperature before opening container. Prior to using, mix thoroughly to re-suspend fillers. If needed, 118-06(SP) can be thinned with small amounts of Creative Materials' 113-12 thinner.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Chemical Resistant
- Electrically Conductive
- Excellent Printability
- Good Thermal Stability
- High Modulus
- High Temperature Resistance
- Long Screen Life
- Low Thermal Expansion
Technical data
Table 1 of 3
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | Latent | — |
| Conductivity | 0.0008 | — |
| Chloride | max. 10 | ppm |
| Sodium Content | max. 10 | ppm |
| Potassium Content | max. 10 | ppm |
Table 2 of 3
7 rows| Characteristic | Value | Unit |
|---|---|---|
| Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C) | 23000 | cps |
| Specific Gravity | 2.68 | water 1 |
| Filler | Silver | — |
| Percent Silver (cured) | min. 74 | % |
| Theoretical Coverage (0.001" Wet Thickness) | 22 | in^2/gram |
| Screen Life | 8 | hrs |
| Solid Content | 86 | % |
Table 3 of 3
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Operating Temperature | -55 to +230 | °C |
| Peak Temperature | 325 | °C |
| Volume Resistivity | 0.0002 | Ω - cm |
| Glass Transition Temperature (Tg) | 100 | ºC |
| Coefficient of Thermal Expansion | 50 | ppm/ºC |
| T-Shear Strength | 2100 | psi |
| Weight Loss (at 300°C, TGA) | 2.77 | % |
| Differential Scanning Calorimetry (DSC) Peak Tc | 168 | ºC |
| Differential Scanning Calorimetry (DSC) ∆ Hc | -33.4 | J/g |
