Creative Materials 126-22-F
126-22-F is an anisotropic conductive, solvent-resistant, transferable adhesive film. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern. This product is available in thicknesses from 1 to 5 mils
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Displays
- Adhesives & Sealants
- Conduits & Cable Management
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
- Conductive Adhesive
- Application Area
Electrical Components, LEDs, PTF Circuits, Ribbon Cables; Electrical Components; LEDs; PTF Circuits; Ribbon Cables
- Compatible Substrates & Surfaces
- Glass, Plastics, Polyimide
- Markets
- Consumer Goods
- Electrical & Electronics
- Storage
- Shelf life: 2 weeks at 25°C, 12 months at -10°C.
- Shelf LIfe
- 12 months at -10°C, 2 weeks at 25°C
- Technology
- Ready-to-Use Products
- Storage and Handling
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove from skin
- Application Procedure
1. As with all adhesive bonds, surface preparation is a vital part of the process. Carefully clean both surfaces to be bonded with MEK if possible. If MEK is not compatible with the surfaces to be bonded, another suitable solvent may be used. 2. Allow cleaned surfaces to dry completely. 3. Die cut 126-22-F to the of the size of interface area, remove one of the protective liners, position onto one of the surfaces to be bonded, and warm the substrate/adhesive to 100°C. 4. By applying pressure, laminate the film/adhesive to the substrate smoothing out any trapped air. Allow to cool to room temperature and peel off the other release liner. 5. Position the other substrate and apply a clamp to provide constant pressure. 6. Cure for 10 minutes at 170°C. 7. Remove pressure. Part is ready for use.
- General Description
- Adhesive Thickness (mils)
- Substrate Type
- Release coated PET
- Conductive Coating Type
- Silver/Polymer
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Anisotropic
- Creasing Resistance
- Excellent Hydrophobic Properties
- Excellent Substrate Adhesion
- Good Scratch Resistance
- Solvent Resistant
- Compatible Substrates and Surfaces
- Glass
- Plastics
- Polyimide
Technical data
Table 1 of 1
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Volume Resistivity (9-cm) (X, Y Axis) | 1x10^12 | — |
| Volume Resistivity (9-cm) (Z Axis) | 0.0001 | — |
| Hydrolytic Stability | Excellent | — |
| Useful Temperature Range | 55 to 200 | ºC |
| Thermal Stability | Good to 250 | °C |
