Creative Materials 127-03-F
- Chemical Family
- Epoxy & Epoxy Derivatives
127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 mils\nFeatures\nExcellent Thermal Conductivity.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Equipment & Parts
- Consumer Electronics
- Displays
- Adhesives & Sealants
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
- Conductive Adhesive, Epoxy Adhesive
- Conductive Adhesive
- Epoxy Adhesive
- Application Area
Electrical Components, Heat Sink, LEDs, Printed Circuit Boards, Semiconductors; Electrical Components; Heat Sink; LEDs; Printed Circuit Boards; Semiconductors
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Handling
This product is shipped frozen and should be stored frozen to optimize shelf life. Care should be taken in handling frozen/cold sheets, they are more likely to crack at this point (avoid flexing film if stored at -40°C). Allow material to warm to room temperature before handling.
- Shelf LIfe
- 1 month at 25°C, 3 months at -10°C
- Technology
- Ready-to-Use Products
- Curing Guidelines
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
- General Description
Substrate Type: PET Release Liner Conductive Coating Type: Aluminum Nitride/Polymer; Adhesive Thickness (mils)
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Chemical Resistant
- Ease of Handling
- Good Thermal Stability
- High Temperature Performance
- Low Thermal Expansion
- Thermally Conductive
Technical data
Table 1 of 1
13 rows| Characteristic | Value | Unit |
|---|---|---|
| Volume Resistivity | 1x10^16 | Q-cm |
| Dielectric Constant (1 KHz) | 4.1 | — |
| Dielectric Constant (1 MHz) | 3.9 | — |
| Dissipation Factor (1 KHz) | 0.027 | — |
| Dissipation Factor (1 MHz) | 0.038 | — |
| Thermal Conductivity | 4.3 | W/mK |
| Operating Temperature | -55 to 230 | °C |
| Peak Temperature | 325 | °C |
| Glass Transition Temperature (Tg) | 1.15 | °C |
| Coefficient of Thermal Expansion below Tg | 50 x 10^-6 | In/in/°C |
| Coefficient of Thermal Expansion above Tg | 60 x 10^-6 | In/in/°C |
| T-Shear Strength | min. 2000 | psi |
