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Creative Materials 124-08A/B
- Chemical Family
- Epoxy & Epoxy Derivatives
Product families
Ready-to-Use Products — Adhesives & Sealants
- Conductive Adhesives
Other characteristics
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Application Area
- Electrical Components
- Application Method
- Injection
- Storage
Shelf life: 12 months at 25°C, in unopened, unmixed containers.
- Shelf LIfe
- 12 months at 25°C
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin
- Application Methods
- Injection
- Curing
Best results are obtained when product is cured at one of the following schedules:
- Mixing Instructions
Premix Parts A and B in original container prior to combining. Add Part B to Part A and mix until uniform.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Electrically Conductive
- Flexible
- Long Potlife
- Medium Modulus
- Thixotropic
Technical data
Table 1 of 2
2 rows| Characteristic | Value |
|---|---|
| Pot Life | 4 days |
| Conductivity | 0.0002 |
Table 2 of 2
11 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | Smooth Paste | — |
| Volume Resistivity | 0.0002 to 0.0004 | Ω-cm |
| Thermal Conductivity | 6.5 | W/mK |
| Glass Transition Temperature (Tg) | 120 | °C |
| Coefficient of Thermal Expansion below Tg | 33 x 10^-6 | in/in/°C |
| Coefficient of Thermal Expansion above Tg | 84 x 10^-6 | in/in/°C |
| Tensile Shear Strength | min. 1500 | psi |
| Solvent Resistance | Excellent | — |
| Specific Gravity | 2.6 | g/cc |
| Useful Temperature Range | -55 to 200 | ºC |
| Thermal Stability | Good to 300 | °C |
