Creative Materials 128-26
- Chemical Family
- Silicones
128-26 is a pourable, thermally conductive, silicone adhesive and potting compound suitable for application by stamping, screen printing, stencil printing, and syringe dispensing. This product features excellent adhesion to Kynar, Kapton, Mylar, glass, and a variety of other surfaces and is very resistant to flexing and creasing. Some applications for 128-26 include but are not limited to potting and encapsulation of stress-sensitive components, thermal management, and low-stress bonding applications.\nFeatures\nOne Component thermally conductive heat cured adhesive.
Properties
- Physical Form
- Liquid
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Adhesives & Sealants
Product Families
- Encapsulants
Other characteristics
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
- Electrical Components
- Application Method
- Injection, Pour, Screen Coating
- Compatible Substrates & Surfaces
- Glass, Plastics, Polyimide
- Markets
- Consumer Goods
- Electrical & Electronics
- Technology
- Ready-to-Use Products
- Safety and Handling
Contains flammable solvents.; Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Injection
- Pour
- Screen Coating
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Creasing Resistance
- Excellent Substrate Adhesion
- Flexing Resistance
- High Hydrolytic Stability
- Thermally Conductive
- Suggested Handling and Curing
128-26 is ready to use as supplied. Further thinning may be accomplished by adding small amounts of 113-12, xylene, or terpineol. Best properties, for most applications, result when cured for 60 minutes at 150°C. Good properties are obtained on a variety of substrates by dry and curing at temperatures ranging from 50°C to 180°C. End user is advised to experimentally determine temperature and time best suited for individual applications.
- Compatible Substrates and Surfaces
- Glass
- Plastics
- Polyimide
Technical data
Table 1 of 1
7 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 60000 | cps |
| Lap Shear Strength | 0.2 | MPa |
| CTE | 80 | ppm/°C |
| Thermal Conductivity | 3.4 | W/m-K |
| Hydrolytic Stability | Excellent | — |
| Useful Temperature Range | -55 to 230 | ºC |
| Thermal Stability | Good to 280 | °C |
