Creative Materials 113-33A/B
- Chemical Family
- Epoxy & Epoxy Derivatives
113-33 is a sag resistant black, flame-out, two component, epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 113-33 is an improved, sag resistant version of 102-11.\nFeatures\nSame as above, but extended pot life; better resistance to thermal cracking.
Product families
Applications
- Potting Compounds
Product Families
- Encapsulants
Other characteristics
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Color
- Black
- Markets
- Electrical & Electronics
- Storage
Shelf Life: 12 months at 25°C in sealed containers.
- Appearance
- Amber (B), Black (A), Black (Mixture)
- Technology
- Ready-to-Use Products
- Safety and Handling
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove from skin.
- Mixing Instructions
Premix Part A in original container prior to adding curing agent. Add Part B to Part A and mix until uniform. Use with standard Part B for room temperature cure.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Crack Resistant
- Good Sagging Resistance
- Pinhole-Free
Technical data
Table 1 of 4
2 rows| Characteristic | Value |
|---|---|
| Mix Ratio | 15 |
| Mix Ratio | 100 |
Table 2 of 4
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | 4 | Hours |
| Pot Life | min. 1/2 (Mixture) | Hrs |
Table 3 of 4
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Handling Properties | 2 - 4 | Hrs |
| Full Cure (25°C) | 24 | Hrs |
| Full Cure (100°C) | 5 - 15 | Hrs |
Table 4 of 4
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 100000 (A) | cps |
| Viscosity | 400 (B) | cps |
| Hardness | 82 | Shore D |
| Coefficient of Thermal Expansion | 22 | in/in/°C x 10^-6 |
| Thermal Conduction | 1.28 | W/m-K |
| Cure Shrinkage | 0.189 | % |
| Heat Distortion Temperature | 85 | °C |
| Fungus Resistance | Non-nutrient | — |
| Tensile Strength | 9600 | psi |
| Water Absorption | max. 0.22 | % |
| Dielectric Strength | 475 | volts/mil |
| Volume Resistivity | 1x 1015 | Q-cm |
