Creative Materials 102-12A/B
- Chemical Family
- Epoxy & Epoxy Derivatives
102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.\n\nFeatures\nThermal cycle resistant
Product families
Applications
- Potting Compounds
Product Families
- Encapsulants
Other characteristics
- Cure Method
- Air Dry
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Color
- Black
- Markets
- Electrical & Electronics
- Cure
- Air Dry
- Technology
- Ready-to-Use Products
- Safety and Handling
Use with adequate ventilation. Keep away from sparks and open flames. Avoid prolonged contact with skin and breathing of vapors. Wash with soap and water to remove from skin.
- Mixing Instructions
Premix Part A in original container prior to adding curing agent. Add Part B to Part A and mix until uniform.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Crack Resistant
- Long Potlife
- Pinhole-Free
- Thermally Conductive
Technical data
Table 1 of 3
1 row| Characteristic | Value |
|---|---|
| Mix Ratio | 100/9 |
Table 2 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity | 15000 | cps |
| Pot Life | 30 | minutes |
| Cure Schedule (24 hr) | 25 | °C |
Table 3 of 3
11 rows| Characteristic | Value | Unit |
|---|---|---|
| Hardness | min. 85 | Shore D |
| Coefficient of Thermal Expansion | 19 | in/in/°C x 10-6 |
| Thermal Conduction | 2.3 | W/mk |
| Cure Shrinkage | 0.173 | % |
| Heat Distortion Temperature | 95 | °C |
| Tensile Strength | 9600 | psi |
| Water Absorption | max. 0.22 | % |
| Dielectric Strength | 475 | volts/mil |
| Volume Resistivity | 1x 10^15 | Q-cm |
| Power Factor (60 HZ) | 0.028 | — |
| Dielectric Constant (at 60 HZ) | 4.4 | — |
