Creative Materials 122-38(SD)
- Chemical Family
- Epoxy & Epoxy Derivatives
122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive, epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, die attachment, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components.\nFeatures
Product families
Applications
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 1K (1 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive
- Application Area
- Electrical Components
- Application Method
- Injection, Screen Coating
- Compatible Substrates & Surfaces
- Painted Surfaces
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months at -40°C, max. 48 hours at 25°C
- Technology
- Ready-to-Use Products
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Injection
- Screen Coating
- Certifications and Compliance
- ISO 9001
- Suggested Handling and Curing
Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. Prior to using, mix container well to resuspend filler. Cure for 10 minutes at 150°C or for 15 minutes at 125°C.
- Ready to Use Product Features
- Chemical Resistant
- Electrically Conductive
- Excellent Coating Performance
- Excellent Substrate Adhesion
- Good Thermal Stability
- High Modulus
- High Temperature Resistance
- Compatible Substrates and Surfaces
- Painted Surfaces
Technical data
Table 1 of 1
17 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | Latent | — |
| Conductivity | 0.0002 | — |
| Viscosity | 85000 | cps |
| Thixotropic Index | min. 5.0 | — |
| Filler | Silver | — |
| Percent Silver (cured) | 72 | — |
| Volume Resistivity | max. 0.0002 | Q-cm |
| Thermal Conductivity | 2.1 | W/m-K |
| Useful Temperature Range | -55 to 230 | ºC |
| Thermal Stability | Good to 325 | °C |
| Lap Shear Strength | 2100 | psi |
| Glass Transition Temperature (Tg) | 98.7 | °C |
