Creative Materials 128-32-25
- Chemical Family
- Epoxy & Epoxy Derivatives
128-32-25 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. This product features excellent adhesion to a variety of metallic contact pad compositions as well as other substrates. Unlike conventional conductive materials, this product is very resistant to solvents, heat, and thermocycling. Applications for 128-32-25 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product offers a faster cure at lower temperatures and will snap cure at higher temperatures. This system features excellent thermal stability. 128-32-25 is optimized for a 0.001†bond line.
Product families
- Conductive Adhesives
Other characteristics
- Product Type
- Conductive Adhesive, Epoxy Adhesive
- Conductive Adhesive
- Epoxy Adhesive
- Application Area
- Electrical Components, Ribbon Cables
- Electrical Components
- Ribbon Cables
- Application Method
- Dip Coating, Injection, Screen Coating
- Compatible Substrates & Surfaces
- Metal
- Technology
- Ready-to-Use Products
- Procedure
Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when cooled to room temperature. A temperature of 50 – 65°C for 5 to 15 minutes is required, B-Stage time is mass related. User is encouraged to experiment for optimum drying time at a given temperature. For increased surface adhesion to some substrates CMI 126-39 can be used.
- Bonding Procedure
To use, apply B-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain location. Cure at one of the above cure schedules. For better adhesion of the b-staged film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing should start after adhesive and substrates reach curing temperature.
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Dip Coating
- Injection
- Screen Coating
- Curing
These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.
- Handling
Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful not entrap air while mixing. 128-32FP can be thinned with small amounts of CMI 113-12 (fast drying), or 102-03 (slow drying) thinners.
- Certifications and Compliance
- ISO 14001
- ISO 9001
- Ready to Use Product Features
- Anisotropic
- Chemical Resistant
- Excellent Substrate Adhesion
- Fast Cure
- Good Thermal Stability
- Heat Resistance
- Long Screen Life
- Low Temperature Curing
- Compatible Substrates and Surfaces
- Metal
Technical data
Table 1 of 3
1 row| Characteristic | Value | Unit |
|---|---|---|
| Minimum Cure Temperature | 80 | °C |
Table 2 of 3
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C) | 15,000 - 25,000 | cps |
| Specific Gravity (water = 1) | 1.17 | g/cc |
| Theoretical Coverage (at 0.001" Thickness) | 35 | in^2 |
| Screen Life | min. 8 | hrs |
| Filler | Silver | — |
Table 3 of 3
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Volume Resistivity (X and Y Axis) | 1x 10^16 | Ω - cm |
| Volume Resistivity (Z) Axis | 0.0001 | Ω - cm |
| Thermal Stability | Good to 325 | °C |
| Useful Temperature Range | -55 to 230 | ºC |
| Glass Transition Temperature (Tg) | 105 | °C |
| Tensile Shear Strength | min. 2000 | Psi |
