Creative Materials 108-50
- Chemical Family
- Epoxy & Epoxy Derivatives
108-50 is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50 can also be used as an adhesive for bonding stress sensitive substrates.\nFeatures\nLow stress, moderate thermally conductive adhesive/potting compound
Product families
Applications
- Potting Compounds
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Potting Compound; 1K (1 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Potting Compound
- Application Method
- Injection
- Markets
- Electrical & Electronics
- Shelf LIfe
1 week at 40°C, 12 months at 0°C, 6 weeks at 25°C
- Technology
- Ready-to-Use Products
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Injection
- Handling
Material is ready to use as received. Store at low temperature to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. Cure for two (2) hours at 150°C. (Note: Best properties are obtained when cured at 121°C for four hours.)
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- High Modulus
- Thermally Conductive
Technical data
Table 1 of 1
11 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | Latent | — |
| Conductivity | 1.83 | W/mK |
| Viscosity (at Room Temperature) | 100,000 - 160,000 | cps |
| Viscosity (at 50°C) | 30,000 - 50,000 | cps |
| Dielectric Strength | 495 | volts/mil |
| Volume Resistivity | 1x 10^14 | Ω - cm |
| Dielectric Constant (1 kHz) | 4.4 | — |
| Dielectric Factor (60 Hz) | 0.012 | — |
| Hardness (at Room Temperature) | 80 | Shore D |
| Hardness (at 121°C) | 35 | Shore D |
| Thermal Conductivity | 1.83 | W/m-K |
