Creative Materials 102-12A/B-187
- Chemical Family
- Epoxy & Epoxy Derivatives
102-12/B-187 is a black, two component, thermally conductive epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12/B-187 exhibits excellent thermal shock resistance and is especially suited to protecting sensitive electronic devices from a range of operating conditions including moisture, vibration, and temperature variation. Other useful applications include, but are not limited to, potting relays, electronic controls, sensors, and inverters and sealing of electronic component housings. Using B-187 allows for faster curing compared to B119-44.\nFeatures
Product families
Applications
- Potting Compounds
Product Families
- Encapsulants
Other characteristics
- Cure Method
- Air Dry
- Product Type
2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound
- Color
- Black
- Markets
- Electrical & Electronics
- Storage
Shelf Life: up to 12 months in unmixed, unopened containers.
- Shelf LIfe
- 12 Months
- Cure
- Air Dry
- Technology
- Ready-to-Use Products
- Mixing Instructions
Premix Part A in original container prior to adding curing agent. Add B-187 to Part A and mix until uniform. NOTE: it is not unusual for crystallization of Part A or B-187 to occur. Warm materials in 40 - 45°C water bath to return to original viscosity. Repeated crystallization and decrystallization does not affect the performance of the product.
- Certifications and Compliance
- ISO 14001
- ISO 9001
- Ready to Use Product Features
- Crack Resistant
- Long Potlife
- Pinhole-Free
- Thermally Conductive
- Handling Instructions
Material is ready to use as received. Remove product from freezer and allow material to warm to room temperature before opening container. Best results are obtained when product is cured at one of the following schedules, but good properties can be achieved by curing at temperatures between 65 and 200°C. End user is advised to experimentally determine temperature and time best suited for individual applications.
Technical data
Table 1 of 2
1 row| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | 4 | Hours |
Table 2 of 2
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Hardness | 85 | Shore D |
| Volume Resistance | 1x 1015 | Q-cm, min |
| Dielectric Strength | 475 | V/mil |
| Power Factor (at 60 Hz) | 0.028 | — |
| Dielectric Constant (at 60 Hz) | 4.4 | — |
| Tensile Strength | 9600 | psi |
| CTE | 14.5 | ppm/°C |
| Heat Distortion Temperature | 148 | °C |
| Thermal Conductivity | 2.3 | W/m-K |
| Cure Shrinkage | 0.171 | % |
| Water Absorption | max. 0.22 | % |
| Fungus Resistance | Non-nutrient | — |
