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Creative Materials 810-44-2A/B

The 810-44-2 System is a two component (A + B) high performance, thermally conductive, room temperature curing epoxy adhesive and potting compound. This is a higher viscosity version of 810-44.\nFeatures\nTwo component, low CTE, low flow epoxy adhesive.

Product families

Applications

Electrical & Electronics — Packaging & Assembly
  • Potting Compounds

Product Families

Ready-to-Use Products — Adhesives & Sealants
  • Encapsulants

Other characteristics

Cure Method
Air Dry
Product Type

2K (2 component) Sealant, Epoxy Sealant, Potting Compound; 2K (2 component) Sealant; Epoxy Sealant; Potting Compound

Color
Black
Markets
Electrical & Electronics
Advantages

810-44-2 is specifically formulated to provide a low coefficient of thermal expansion and minimal flow during cure.

Shelf LIfe

One Year at 25°C (both A+B). Hand agitation of both components is recommended after long standing to insure best results.

Cure
Air Dry
Instruction

Combine the Resin and the Hardener in the ratio listed above. Mix by hand or mechanical mixer until material is uniform in appearance.

Technology
Ready-to-Use Products
Cure Schedule

16 hours @ 25°C (77°F) will yield 80% of the systems full potential. An additional 24 hours @ 25°C (77°F) will yield the systems full potential).. Pot Life (20 grams) @ 25°C = 4 hours

Storage and Handling

Normal storage and handling is at room temperature. Use standard mixing and housekeeping procedures to minimize the risk of spills and contact with the surrounding material

Certifications and Compliance
  • ISO 14001
  • ISO 9001
Ready to Use Product Features
  • Low Thermal Expansion
  • Thermally Conductive

Technical data

Table 1 of 2

1 row
CharacteristicValueUnit
Pot Life4Hours

Table 2 of 2

3 rows
CharacteristicValueUnit
Hardness (measured at 25°C)84Shore D
Thermal Conductivity (at 121°C)1.46Btu ft/ft2 -hr-°F
Operating Temperature Range20 to +125°C

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