Creative Materials 127-31
- Chemical Family
- Epoxy & Epoxy Derivatives
127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.\nFeatures
Properties
- Physical Form
- Liquid
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Potting Compound, Solvent free (100% Solids) Adhesive; 1K (1 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Potting Compound; Solvent free (100% Solids) Adhesive
- Application Method
- Injection
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months at -10°C, max. 4 days at 25°C
- Technology
- Ready-to-Use Products
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Injection
- Suggested Handling and Curing
If frozen remove product from freezer and allow material to warm to room temperature before opening container. Best results are obtained when curing at one of the following schedules:
- Ready to Use Product Features
- Chemical Resistant
- Electrically Insulating
- Flexible
- Good Thermal Stability
- High Temperature Performance
- Low Modulus
- Thermally Conductive
Technical data
Table 1 of 2
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | Latent | — |
| Conductivity | 3 | W/mK |
Table 2 of 2
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Filler | Aluminum Nitride | — |
| Percent Filler | min. 60 | — |
| Volume Resistivity | max. 1X 10^16 | Q-cm |
| Dielectric Constant (1KHz) | 4.1 | — |
| Dielectric Constant (1MHz) | 3.9 | — |
| Dissipation Factor (1KHz) | 0.027 | — |
| Dissipation Factor (1MHz) | 0.038 | — |
| Useful Temperature Range | -55 to 230 | ºC |
| Thermal Stability | Good to 325 | °C |
| Thermal Conductivity | 3 | W/m-K |
| Hardness (100°C cure) | max. 40A | Shore A |
| Hardness (175°C post cure) | max. 60A | Shore A |
