Creative Materials 125-31FPC
- Chemical Family
- Epoxy & Epoxy Derivatives
125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.\nFeatures
Product families
Applications
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 1K (1 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive
- Application Method
- Injection
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months at -40°C, max. 4 days at 25°C
- Technology
- Ready-to-Use Products
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Injection
- Certifications and Compliance
- ISO 9001
- Suggested Handling and Curing
Material is ready to use as received. If frozen remove product from freezer and allow material to warm to room temperature before opening container. Best results are obtained when the product is cured at one of the following schedules:
- Ready to Use Product Features
- Chemical Resistant
- Electrically Insulating
- Flexible
- Good Thermal Conductivity
- Good Thermal Stability
- High Temperature Performance
- Medium Modulus
- Thermally Conductive
Technical data
Table 1 of 1
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | 4 days | — |
| Conductivity | 5.5 | W/mK |
| Viscosity | 80000 | cps |
| Filler | Aluminum Nitride | — |
| Percent Filler (cured) | min. 65 | — |
| Volume Resistivity | max. 1X 10^16 | Q-cm |
| Dielectric Constant (1KHz) | 4.1 | — |
| Dielectric Constant (1MHz) | 3.9 | — |
| Dissipation Factor (1KHz) | 0.027 | — |
| Dissipation Factor (1MHz) | 0.038 | — |
| Useful Temperature Range | -55 to 230 | ºC |
| Thermal Stability | Good to +325 | °C |
