Creative Materials 128-21C
- Chemical Family
- Epoxy & Epoxy Derivatives
128-21C is a jet or syringe dispensable, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 128-21C is flexible and can absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 128-21C is a version of 125-31C optimized for jet dispensing.\nFeatures
Product families
Applications
- Printed Circuit Boards (PCBs)
Product Families
- Conductive Adhesives
Other characteristics
- Product Type
1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 1K (1 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Application Method
- Injection
- Markets
- Electrical & Electronics
- Shelf LIfe
3 months at -10°C, 4 days at 25°C, 6 months at -40°C
- Technology
- Ready-to-Use Products
- Safety and Handling
Use with adequate ventilation.; Keep away from sparks and open flames.; Avoid prolonged contact with skin and breathing of vapors.; Wash with soap and water to remove from skin.
- Application Methods
- Injection
- Certifications and Compliance
- ISO 14001
- ISO 9001
- Ready to Use Product Features
- Chemical Resistant
- Electrically Insulating
- Good Thermal Stability
- High Flexibility
- High Modulus
- High Temperature Performance
- Medium Modulus
- Thermally Conductive
- Handling Instructions
Material is ready to use as received. If frozen remove product from freezer and allow material to warm to room temperature before opening container. Good results are obtained when the product is cured at one of the following schedules but longer times and higher temperatures will always provide improved properties.
Technical data
Table 1 of 1
13 rows| Characteristic | Value | Unit |
|---|---|---|
| Pot Life | 4 days | — |
| Conductivity | 3.1 | W/mK |
| Viscosity (10 s-1) | 135000 | cps |
| Thixotropic lIndex (1/10 s-1) | min. 2.5 | — |
| Filler | Nitride blend | — |
| Volume Resistivity | max. 1X 10^16 | Q-cm |
| Useful Temperature Range | -55 to 230 | ºC |
| Thermal Stability | Good to +325 | °C |
| Lap Shear Strength | 1800 | psi |
| Glass Transition Temperature (TMA) | 92 | °C |
| Coefficient of Thermal Expansion below Tg | 61 | ppm/°C |
| Coefficient of Thermal Expansion above Tg | 209 | ppm/°C |
