ResinLab® SEC1222 Part A
Resinlab® SEC1222 Part A is a silver filled, two component epoxy adhesive designed to cure completely at room temperature. It has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. SEC1222 provides exceptionally high electrical conductivity starting immediately after mixing that improves as the curing process proceeds. It also has the additional benefit of very high thermal conductivity due to its high silver loading. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- ResinLab
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive
- Compatible Substrates & Surfaces
- Metal
- Markets
- Consumer Goods
- Electrical & Electronics
- Instructions
Bring both components to room temperature prior to mixing. Stir to assure homogeneous consistency.; Weigh and mix parts A and B accurately and thoroughly, scraping sides of container. Often small amounts are mixed by laying out equal length beads on a glass slide and using a metal spatula to mix.; Allow to cure undisturbed.; Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.
- Technology
- Ready-to-Use Products
- Shelf Life Storage
6 months at 25°C; As one-part pre-mixed and frozen: 6 months DOP at -40 °C; Specialty packaging may be less.; NOTE: When supplied in non-PMF two-part packaging, Part A should be stored between 15 and 35°C to prevent crystallization or separation. In the event of crystallization, warm Part A to 40-50°C and stir until uniform.
- Ready to Use Product Features
- Electrically Conductive
- Good Adhesion
- Good Thermal Conductivity
- Thixotropic
- Compatible Substrates and Surfaces
- Metal
Technical data
Table 1 of 1
25 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mix Ratio | Part A to Part B | — | — |
| Mix Ratio (By Weight) | 1:1 | — | — |
| Mix Ratio (By Volume) | 1:1 | — | — |
| Cure Schedule (at 25°C) | 24.0 - 72.0 | h | — |
| Cure Schedule (at 60°C) | 1.0 | h | — |
| Viscosity (Mixed, Rheometer parallel plate 25mm at 1/s) | 560000.0 | cps | — |
| Specific Gravity (Part A) | 3.88 | — | — |
| Specific Gravity (Part B) | 3.93 | — | — |
| Specific Gravity (Mixed) | 3.91 | — | — |
| Pot Life | 45.0 | min | — |
| Glass Transition Temperature (Tg) | 17.0 | °C | DSC |
| Hardness | 70.0 | Shore D | ASTM D2240 |
