ResinLab® EP1115 Clear Part A
Resinlab® EP1115 Clear Part A is a two-part unfilled epoxy adhesive designed for bonding metals, ceramics and most plastics. This product gives good resistance to water, salt spray, inorganic acids and bases and most organic solvents. This product will have better water and temperature resistance than standard “5-minute” epoxy adhesives. EP1115 Clear was formulated to a 1A:1B volume mix ratio for use in side by side dispensing cartridges and meter/mix and dispense equipment. A handling cure is normally achieved at room temperature within 1 – 2 hours with full cure properties reached in 24 hours. Cure time can be accelerated by the application of heat to reach final cure properties quickly. Times of 30 minutes at 65 °C to 10 minutes at 100 °C is typical for most applications. Cooler temperatures will extend work time and increase cure times.
Product families
- Other Adhesives & Sealants
Other characteristics
- Brand
- ResinLab
- Product Type
- 2K (2 component) Adhesive, Epoxy Adhesive
- 2K (2 component) Adhesive
- Epoxy Adhesive
- Compatible Substrates & Surfaces
- Ceramic, Metal, Plastics
- Markets
- Adhesives & Sealants
- Applications
Adhesives & Sealants — Other Adhesives & Sealants Applications
- Instructions
Bring both components to room temperature prior to mixing.; Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.; Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.; Allow to cure undisturbed until product is fully gelled or tack-free to the touch.; Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Shelf Life Storage
12 months at 25 °C; Specialty packaging may be less.; Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5 to 50 °C) aggravate this phenomenon. Heating the individual component to 50 to 60 °C while stirring can usually restore products to original state. Storage at 25 +/- 10 °C is optimum for most products.
- Ready to Use Product Features
- Chemical Resistant
- Excellent Salt Spray Resistance
- Good Sagging Resistance
- High Temperature Resistance
- Thixotropic
- Water Resistant
- Compatible Substrates and Surfaces
- Ceramic
- Metal
- Plastics
Technical data
Table 1 of 1
37 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mix Ratio | Part A to Part B | — | — |
| Dissipation Factor (at 100 Hz) | 0.009 | — | ASTM D150 |
| Dissipation Factor (at 100 Hz) | 0.026 | — | ASTM D150 |
| Mix Ratio (By Weight) | 1.10:1 | — | — |
| Mix Ratio (By Volume) | 1:1 | — | — |
| Cure Schedule (at 25°C) | 24.0 | h | — |
| Cure Schedule (at 65°C) | 30.0 | min | — |
| Cure Schedule (at 100°C) | 10.0 | min | — |
| Viscosity (Part A,Rheometer parallel plate 25mm at 1/s) | 14000.0 | cps | — |
| Viscosity (Part B,Rheometer parallel plate 25mm at 1/s) | 42000.0 | cps | — |
| Viscosity (Mixed Rheometer parallel plate 25mm at 1/s) | 30000.0 | cps | — |
| Specific Gravity (Part A) | 1.16 | — | — |
