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ResinLab® SEC1244 Part A

Resinlab® SEC1244 Part A is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product will cure very quickly at high temperatures. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
  • Adhesives & Sealants

Product Families

Ready-to-Use Products — Adhesives & Sealants
  • Conductive Adhesives

Other characteristics

Brand
ResinLab
Product Type

2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive

Compatible Substrates & Surfaces
Metal
Markets
  • Consumer Goods
  • Electrical & Electronics
Technology
Ready-to-Use Products
Material Features
Outdoor Durability
Ready to Use Product Features
  • Electrically Conductive
  • Good Adhesion
  • Good Thermal Conductivity
  • Thixotropic
Compatible Substrates and Surfaces
Metal

Technical data

Table 1 of 1

27 rows
CharacteristicValueUnitMethod
Mix RatioPart A to Part B——
Mix Ratio (By Weight)1.05:1——
Mix Ratio (By Volume)1:1——
Cure Schedule (at 150°C)5.0min—
Cure Schedule (at 120°C)15.0min—
Cure Schedule (at 100°C)60.0min—
Viscosity (Mixed at 2.5 rpm)234000.0cps—
Viscosity (Mixed at 5 rpm)126000.0cps—
Viscosity (Mixed Rheometer parallel plate 25mm at 1/s)298000.0cps—
Specific Gravity (Part A)4.09——
Specific Gravity (Part B)4.33——
Specific Gravity (Mixed)4.21——

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