ResinLab® EP1026T3 Part A
ResinLab® EP1026T3 Part A is a two-part unfilled epoxy adhesive designed for high-speed bonding of metals, ceramics, and most plastics. It cures to a tough, semi-rigid material. The thixotropic paste consistency prevents running and sagging. This formula will have good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. EP1026T3 CLEAR was formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1026T3 CLEAR will reach handle cure at room temperature within 20-30 minutes and full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly. Times and temperatures are listed below. Time to heat substrate must be considered. Cooler temperatures will also extend work time and increase cure times.
Product families
- Other Adhesives & Sealants
Other characteristics
- Brand
- ResinLab
- Cure Method
- Air Dry
- Product Type
- 2K (2 component) Adhesive, Epoxy Adhesive
- 2K (2 component) Adhesive
- Epoxy Adhesive
- Compatible Substrates & Surfaces
- Ceramic, Metal, Plastics
- Markets
- Adhesives & Sealants
- Cure
- Air Dry
- Applications
Adhesives & Sealants — Other Adhesives & Sealants Applications
- Instructions
Bring both components to room temperature prior to mixing.; Cartridge format: Mixer should be attached keeping the cartridge vertical and any air pocket purged this way. After the mixer contains material, the mixer tip can be dropped to dispense pre-bleed amount. Attach a new static mixer with each cartridge, then pre-bleed the first 3 inches of dispensed material or until a uniform color is obtained. Maintain adequate velocity during dispensing to ensure complete mixing.; Bulk format: weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Do not pour from mixing container, transfer to a new container as residual unmixed material may cause a tacky spot on the surface of the casting. Maintain adequate velocity during dispensing to ensure complete mixing.; Allow to cure undisturbed until product is fully gelled or tack-free to the touch.; Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.
- Technology
- Ready-to-Use Products
- Shelf Life Storage
12 months at 25 °C; Specialty packaging may be less.; Many epoxy resin systems are prone to crystallization as epoxy resin is a super-cooled fluid. This condition may give the product a gritty or grainy appearance (or hazy in clear products). Products in this state will not usually cure to normal and expected properties. In extreme cases it may appear solid and cured. Fluctuating temperatures (within 5 to 50 °C) aggravate this phenomenon. Heating the individual component to 50 to 60 °C while stirring can usually restore products to original state. Storage at 25 +/- 10 °C is
- Ready to Use Product Features
- Chemical Resistant
- Excellent Salt Spray Resistance
- Fast Setting
- Good Sagging Resistance
- Water Resistant
- Compatible Substrates and Surfaces
- Ceramic
- Metal
- Plastics
Technical data
Table 1 of 1
33 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mix Ratio | Part A to Part B | — | — |
| Dissipation Factor (at 100 Hz) | 0.05 | — | ASTM D150 |
| Mix Ratio (By Weight) | 1.02:1 | — | — |
| Mix Ratio (By Volume) | 1:1 | — | — |
| Cure Schedule (at 65°C) | 30.0 | min | — |
| Cure Schedule (at 100°C) | 30.0 | min | — |
| Viscosity (Part A,Rheometer parallel plate 25mm at 1/s) | 720000.0 | cps | — |
| Viscosity (Part B,Rheometer parallel plate 25mm at 1/s) | 560000.0 | cps | — |
| Viscosity (Mixed Rheometer parallel plate 25mm at 1/s) | 485000.0 | cps | — |
| Specific Gravity (Part A) | 1.19 | — | — |
| Specific Gravity (Part B) | 1.17 | — | — |
| Specific Gravity (Mixed) | 1.18 | — | — |
