ResinLab® SEC1233 Part A
Resinlab® SEC1233 Part A is a silver filled, two component, room temperature curing epoxy adhesive. SEC1233 has excellent electrical conductivity useful in many electronic applications. It is a soft 100% solids thixotropic paste provided in a 1:1 ratio. It is recommended to mix by weight but extrusion of equal length beads from syringes is commonly used as a method of measurement as small quantities are commonly used. It also can be packaged in small side-by-side dispensing cartridges for use with static mixers. This system is also available in a pre-mixed and frozen format. SEC1233 provides exceptionally high conductivity starting immediately after mixing and improves during the curing process. It also has high thermal conductivity due to its high silver content. It provides environmental protection and has tenacious adhesion to various metals and other common assembly materials.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- ResinLab
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive
- Compatible Substrates & Surfaces
- Metal
- Markets
- Consumer Goods
- Electrical & Electronics
- Instructions
Bring both components to room temperature prior to mixing. Stir to assure homogeneous consistency.; Weigh and mix parts A and B accurately and thoroughly, scraping sides of container often. Small amounts can be mixed by dispensing out equal length beads on a glass slide and using a metal spatula to mix.; Allow to cure undisturbed until product is fully gelled or tack-free to the touch.; Clean up uncured resin with suitable organic solvent such as MEK, acetone or other organic solvent.
- Technology
- Ready-to-Use Products
- Ready to Use Product Features
- Electrically Conductive
- Good Adhesion
- Good Thermal Conductivity
- Thixotropic
- Compatible Substrates and Surfaces
- Metal
Technical data
Table 1 of 1
28 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mix Ratio | Part A to Part B | — | — |
| Mix Ratio (By Weight) | 1:1 | — | — |
| Mix Ratio (By Volume) | 1:1 | — | — |
| Cure Schedule (Full cure at room temperature in 24-72 hours,at 60°C) | 1.0 | h | — |
| Viscosity (Mixed at 2.5 rpm) | 172000.0 | cps | — |
| Viscosity (Mixed at 5.0 rpm) | 82250.0 | cps | — |
| Viscosity (Mixed at 10.0rpm) | 29500.0 | cps | — |
| Viscosity (Mixed at 1/s) | 582000.0 | cps | — |
| Specific Gravity (Part A) | 3.88 | — | — |
| Specific Gravity (Part B) | 3.97 | — | — |
| Pot Life (Defined as the time it takes for initial mixed viscosity to double, Rheometer parallel plate 25mm at 1/s) | min. 4 | h | — |
| Glass Transition Temperature (Tg) | 10.0 | °C | DSC |
