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Crosslink Technologies CLH5515
- Chemical Family
- Epoxy & Epoxy Derivatives
Crosslink Technologies CLH5515 is a two component, unfilled, heat cure epoxy system. It was specifically developed for impregnating coils. The cured material exhibits excellent thermal stability and thermal cycling characteristics.
Product families
Applications
Applications
- Electrical & Electronics — Other Electrical & Electronics Applications
Electrical & Electronics — Devices & Assemblies
- Other Devices & Assemblies
Electrical & Electronics — Packaging & Assembly
- Potting Compounds
Product Families
Plastics — Thermoset Resins
- Epoxies
Other characteristics
- End Uses
Electrical Components, Electrical/Electronic Applications, Encapsulant
- Polymer Name
- Epoxy Resins & Compounds
- Volume Resistivity
- 5000000000000.0 - 5000000000000.0 Ohm-m
- Markets
- Electrical & Electronics
- Shelf LIfe
- 12 Months
- Cure
- Heat Cure
- Technology
- Plastics
- Cure Schedule
- Recommended Cure Schedule at 125°C - 4 Hrs
- Alternate Cure Schedule at 100°C - 8 Hrs.
- Optional Postcure at 150°C - 2 Hrs.
- Material Features
- Excellent Toughness
- Good Thermal Stability
- Plastics and Elastomers End Uses
- Electrical Components
- Electrical/Electronic Applications
- Encapsulant
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 4
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity at 70°C | 5,000 - 15,000 | cps |
| Specific Gravity | 1.14 - 1.18 | g/cm³ |
Table 2 of 4
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Dielectric Constant at 1 KHz | 3.5 | — |
| Dissipation Factor at 1 KHz | 0.02 | — |
| Dielectric Strength (62 Mil/Section) | 380 | Volts/Mil |
| Arc Resistance | 170 | Seconds |
| Volume Resistivity | 5.0 x10^14 | Ohm/Cm |
Table 3 of 4
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density | 1.15 | gm/Cm³ | — |
| Hardness | 70 | Shore D | — |
| Guide To Operating Temperature | 155 | °C | — |
| Linear Shrinkage | 0.02 | In/In | Astm D 2566 |
| Tensile Strength | 3700 | Psi | Astm D 638 |
| Tensile Elongation | 100 | % | Astm D 638 |
| Coefficient of Thermal Expansion | 180X10^-6 | in/in/°C | — |
| Thermal Conductivity | 4.5X10^-4 | Cal/Sec.Cm.°C | — |
| Moisture Absorption | 0.2 | % | — |
Table 4 of 4
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio By Weight | 100:150.0 | — |
| Mixed Viscosity at 60°C | 2250 | cps |
| Pot Life Of 200 gm. mass at 60°C | 90 | minutes |
| Gel Time Of 200 gm. mass at 125°C | 2 | hours |
