Crosslink Technologies XR61406

Chemical Family: Epoxy & Epoxy Derivatives

Crosslink Technologies XR61406 is a low density epoxy casting system. product is recommended for reducing weight, when casting and potting small electronic modules. Product is suitable for operating in environments from -40c. to +120c.

Product families

Applications

Electrical & Electronics — Other Electrical & Electronics Applications

Electrical & Electronics — Packaging & Assembly

Potting Compounds

Product Families

Plastics — Thermoset Resins

Epoxies

Other characteristics

End Uses: Electrical Components, Electrical/Electronic Applications, Encapsulant
Polymer Name: Epoxy Resins & Compounds
Processing Methods: Potting
Volume Resistivity: 2050000000000.0 - 2050000000000.0 Ohm-m
Markets: Electrical & Electronics
Shelf LIfe: 12 Months
Cure: Air Dry
Technology: Plastics
Cure Schedule: Recommended Cure Schedule at 22 °C - 48 Hrs
Alternate Cure Schedule at 60 °C - 4 Hrs.
Material Features: Light Weight
Low Density
Plastics and Elastomers End Uses: Electrical Components
Electrical/Electronic Applications
Encapsulant
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Potting

Technical data

Table 1 of 4

2 rows

Characteristic	Value	Unit
Viscosity	3000 - 6000	cps
Specific Gravity	0.69 - 0.75	g/cm³

Table 2 of 4

4 rows

Characteristic	Value	Unit
Dielectric Constant at 1 KHz	3	—
Dissipation Factor at 1 KHz	0.02	—
Dielectric Strength (62 Mil/Section)	430	Volts/Mil
Volume Resistivity	2.05 x10^14	Ohm/Cm

Table 3 of 4

10 rows

Characteristic	Value	Unit	Method
Density	0.74	gm/Cm³	—
Hardness	70	Shore D	—
Guide To Operating Temperature	120	°C	—
Linear Shrinkage	0.0002	In/In	Astm D 2566
Tensile Strength	4500	Psi	Astm D 638
Tensile Elongation	9	%	Astm D 638
Coefficient of Thermal Expansion	40X10^-6	in/in/°C	—
Thermal Conductivity	4.1X10^-4	Cal/Sec.Cm.°C	—
Moisture Absorption	0.4	%	—
Flextural Strength	5500	Psi	—

Table 4 of 4