Crosslink Technologies CLH6500

Chemical Family: Epoxy & Epoxy Derivatives

Crosslink Technologies CLH6500 is a two component, room temperature cure semi-flexible epoxy system. the system was developed for potting/casting of electrical and electronic components. its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment.

Product families

Applications

Electrical & Electronics — Other Electrical & Electronics Applications

Electrical & Electronics — Packaging & Assembly

Potting Compounds

Product Families

Plastics — Thermoset Resins

Epoxies

Other characteristics

End Uses: Electrical Components, Electrical/Electronic Applications, Encapsulant, General Purpose
Polymer Name: Epoxy Resins & Compounds
Processing Methods: Casting, Potting
Volume Resistivity: 2000000000000.0 - 2000000000000.0 Ohm-m
Markets: Electrical & Electronics
Shelf LIfe: 12 Months
Cure: Air Dry
Technology: Plastics
Cure Schedule: Recommended Cure Schedule at 60 °C - 6 Hrs
Alternate Cure Schedule at 22 °C - 7 days
Material Features: Cost Effective
Filled
General Purpose
Plastics and Elastomers End Uses: Electrical Components
Electrical/Electronic Applications
Encapsulant
General Purpose
Plastics and Elastomers Functions: Resin
Plastics and Elastomers Processing Methods: Casting
Potting

Technical data

Table 1 of 4

2 rows

Characteristic	Value	Unit
Viscosity	6,000 - 12,000	cps
Specific Gravity	1.54 - 1.60	g/cm³

Table 2 of 4

4 rows

Characteristic	Value	Unit
Dielectric Constant at 1 KHz	4.2	—
Dissipation Factor at 1 KHz	0.02	—
Dielectric Strength (125 Mil/Section)	380	Volts/Mil
Volume Resistivity	2.0 x10^14	Ohm/Cm

Table 3 of 4

6 rows

Characteristic	Value	Unit	Method
Density	1.57	gm/Cm³	—
Hardness	65	Shore D	—
Guide To Operating Temperature	130	°C	—
Tensile Strength	1100	Psi	Astm D 638
Tensile Elongation	50	%	Astm D 638
Thermal Conductivity	18X10^-4	Cal/Sec.Cm.°C	—

Table 4 of 4