RTduroid® 6035HTC Laminates
- Chemical Family
- Fluoropolymers
RT/duroid® 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications.
Product families
Applications
- Printed Circuit Boards (PCBs)
- Aerospace & Aviation
Product Families
- Laminates
Other characteristics
- Brand
- RTduroid
- Functions
- Laminate
- Reinforcement Material
- Glass Fibers
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Features
High Thermal conductivity; Improved dielectric heat dissipation enables lower operating temperatures for high power applications; Low loss tangent; Excellent high frequency performance; Thermally stable low profile and reverse treat copper foil; Lower insertion loss and excellent thermal stability of traces; Advanced filler system; Improved drill ability and extended tool life compared to alumina containing circuit material; Low loss for excellent high frequency performance; Tight εr and thickness control; Excellent electrical and mechanical properties; Extremely low thermal coefficient of dielectric constant; In-plane expansion coefficient matched to copper; Very low etch shrinkage
- Technology
- Composite Materials
- Material Features
- Chemical Resistant
- Dimensional Stability
- Good Electrical Properties
- Good Mechanical Properties
- HIGHLIGHTS
RT/duroid® 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/ duroid 6035HTC laminates are an exceptional choice for high power applications. Rogers advanced filler system enables excellent drill ability, reducing drilling costs as compared to standard high thermally conductive laminates which use alumina fillers.
- Recommended Applications
High power RF and microwave amplifiers; Power amplifiers, couplers, filters, combiners, power dividers; Phased Array Antennas; Ground Based and Airborne Radar Systems; Global Positioning System Antennas; Power Backplanes; High Reliability Complex Multilayer Circuits; Commercial Airline Collision Avoidance Systems; Beam Forming Networks
- Composite Materials Functions
- Laminate
Technical data
Table 1 of 1
17 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant, εr, Process at 10 MHz | 3.50 ± 0.05 | — | IPC-TM-650 2.5.5.5 |
| Surface Resistivity | 1x 10^8 | MΩ | IPC-TM-650, 2.5.17.1 |
| Dielectric Constant, εr, Design | 3.6 | — | Differential Phase Length Method |
| Volume Resistivity | 1x 10^8 | MΩ-cm | IPC-TM-650, 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0013 | — | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -66 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Tensile Modulus (MD) | 329 | kpsi | ASTM D638 |
| Tensile Modulus (CMD) | 244 | kpsi | ASTM D638 |
| Dimensional Stability (CMD) | -0.011 | mm/m | IPC-TM-650, 2.4.39A |
| Dimensional Stability (MD) | -0.08 | mm/m | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion - X Axis | 19 | ppm/°C | IPC-TM-650 2.4.41 |
| Coefficient of Thermal Expansion - Y Axis | 19 | ppm/°C | IPC-TM-650 2.4.41 |
