RTduroid® 6202PR Laminates
RT/duroid® 6202PR high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable and used for planar resistor applications.
Product families
- Laminates
Other characteristics
- Brand
- RTduroid
- Functions
- Laminate
- Reinforcement Material
- Glass Fibers
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Technology
- Composite Materials
- Material Features
- Chemical Resistant
- Dimensional Stability
- Good Electrical Properties
- Good Mechanical Properties
- HIGHLIGHTS
RT/duroid® 6202PR high frequency circuit material is a low loss and low dielectric constant laminate offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable and used for planar resistor applications. Excellent dimensional stability (0.05 to 0.07 mils/inch) is achieved by the addition of limited woven glass reinforcement. This enables the manufacture of tight tolerance planar resistors. ¼ oz. to 2 oz./ft.2 electrodeposited copper foil , ½ oz., 1 oz. and 2 oz. rolled copper foil, ½ oz., 1oz. and 2 oz. reverse treated foil and ½ oz. and 1 oz. electrodeposited copper foil with a resistive layer, may be specifi ed as cladding on 0.005" (0.127mm), 0.010" (0.254mm), 0.015" (0.381mm), & 0.020" (0.508mm) standard dielectric thicknesses. RT/duroid 6002PR (non-reinforced) available in 0.020 and 0.030 dielectric thicknesses. Applications particularly suited to the unique properties of RT/duroid 6202PR material include fl at and non-planar structures such as antennas and complex multi-layer circuits with inter-layer connections
- Recommended Applications
- Phased Array Antennas
- Ground Based and Airborne Radar Systems
- Global Positioning System Antennas
- Power Backplanes
- High Reliability Complex Multi-layer Circuits
- Commercial Airline Collision Avoidance
- Beam Forming Networks
- Composite Materials Functions
- Laminate
Technical data
Table 1 of 1
18 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant, εr, Process and Design at 10 MHz | 2.90 ± 0.04 | — | IPC-TM-650 2.5.5.5 |
| Surface Resistivity | 1 x 10^9 | MΩ | IPC-TM-650, 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.002 | — | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1 x 10^10 | MΩ-cm | IPC-TM-650, 2.5.17.1 |
| Thermal Coefficient of εr | 13 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Tensile Modulus | 146 | kpsi | ASTM D638 |
| Tensile Ultimate Stress | 4.3 | kpsi | ASTM D638 |
| Tensile Ultimate Strain | 4.9 | % | ASTM D638 |
| Compressive Modulus | 150 | kpsi | ASTM D695 |
| Moisture Absorption | 0.1 | % | ASTM D570 |
| Thermal Conductivity | 0.68 | W/m/°K | ASTM C518 |
| Coefficient of Thermal Expansion - X Axis | 15 | ppm/°C | IPC-TM-650 2.1.41 |
