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RO4360G2™ Laminates

RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. RO4003C™, RO4350B™, RO4360G2™, and RO4835™ laminates are available clad with the Ticer TCR Thin Film resistor foils. Ticer TCR clad RO4000 laminates are available in 0.5oz (18µm) thick foil with resistor values of 25, 50, and 100 Ω/sq(1). 1oz (35µm) thick copper foils are available as special order.

Product families

Applications

Electrical & Electronics — Parts & Components
  • Printed Circuit Boards (PCBs)
Automotive & Transportation — Transportation
  • Aerospace & Aviation

Product Families

Composite Materials — Prepregs & Molding Compounds
  • Laminates

Other characteristics

Brand
RO4360G2
Functions
Laminate
Markets
  • Automotive & Transportation
  • Electrical & Electronics
Technology
Composite Materials
Material Features
  • Chemical Resistant
  • Dimensional Stability
  • Good Electrical Properties
  • Good Mechanical Properties
Composite Materials Functions
Laminate

Technical data

Table 1 of 1

20 rows
CharacteristicValueUnitMethod
Dielectric Constant, εr, Process6.15 ± 0.15—IPC-TM-650 2.5.5.5 Clamped Stripline
Surface Resistivity9 x 10^12MΩIPC-TM-650, 2.5.17.1
Dissipation Factor, tan d0.0038—IPC-TM-650 2.5.5.5
Volume Resistivity4 x 10^15MΩ-cmIPC-TM-650, 2.5.17.1
Thermal Conductivity0.75W/m/°KASTM D-5470
Electrical Strength784V/milIPC-TM-650, 2.5.6.2
Tensile Strength19kpsiASTM D638
Tensile Strength14kpsiASTM D638
Flexural Strength31kpsiIPC-TM-650, 2.4.4
Flexural Strength21kpsiIPC-TM-650, 2.4.4
Coefficient of Thermal Expansion - X Axis13ppm/°CASTM D3386-94
Coefficient of Thermal Expansion - Y Axis14ppm/°CASTM D3386-94

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