CuClad® 217 Laminates
- Chemical Family
- Fluoropolymers
CuClad 217(Er=2.17, 2.20) uses a low fiberglass/PTFE ratio to provide the lo west di electric constant and di ssipation factor available in fiberglass reinforced PTFE based laminates. Together, these prop erties offer fas ter signal propagati on and higher signal/noise ratios.
Product families
Applications
- Printed Circuit Boards (PCBs)
Product Families
- Laminates
Other characteristics
- Brand
- CuClad
- Functions
- Laminate
- Reinforcement Material
- Glass Fibers
- Markets
- Electrical & Electronics
- Benefits
Electrical and Mechanical Isotropy in the X-Y Plane; Extremely Low Loss; Well Suited for Er Sensitive Circuits
- Features
Cross Plied Woven Fiberglass, alternating plies are oriented 90o to each other; High PTFE to Glass Ratio; Better dielectric constant uniformity than comparable non-woven fiberglass reinforced laminates
- Technology
- Composite Materials
- Material Features
- Dimensional Stability
- Good Electrical Properties
- Good Mechanical Properties
- Availability
CuClad laminates ar e suppli ed with 1/2, 1 or 2 oun ce electrodeposi ted copper on both s ides. Other copper wei ghts and rolle d cop per foil are avai lable. CuClad i s avai lable bonded t o a heavy metal ground plane. Aluminum, brass or cop per plates also provi de an i ntegral heat sink and mechanical support to the substrate. When ordering CuClad products please specify dielectric constant, thickness, cladding, panel size and any other special considerations. Available master sheet sizes include 36" x 36" in a crossplied configuration and 36" x 48" in a parallel plied configuration.
- Recommended Applications
Military Electronics (Radars, ECM, ESM); Microwave Components (LNAs, filters, couplers, etc.)
- Composite Materials Functions
- Laminate
Technical data
Table 1 of 1
22 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant at 10GHz | 2.17, 2.20 | — | IPC TM-650 2.5.5.5 |
| Surface Resistivity | 3.4 x 10^6 | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Constant at 1MHz | 2.17, 2.20 | — | IPC TM-650 2.5.5.3 |
| Volume Resistivity | 2.3 x 10^8 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0009 | — | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of εr | -151 | ppm/°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength | 14 | lb/in | IPC TM-650 2.4.8 |
| Arc Resistance | min. 180 | seconds | ASTM D-495 |
| Tensile Modulus | 275, 219 | kpsi | ASTM D-638 |
| Tensile Strength | 8.8, 6.6 | kpsi | ASTM D-882 |
| Compressive Modulus | 237 | kpsi | ASTM D-695 |
| Flexural Modulus | 357 | kpsi | ASTM D-790 |
