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IsoClad® 917 Laminates

Chemical Family
Fluoropolymers

IsoClad 917 (Er=2.17, 2.20) uses a low ratio of fiberglass/PTFE to achieve the lowest dielectric constant and dissipation factor available in a combination of PTFE and fiberglass.

Product families

Applications

Electrical & Electronics — Parts & Components
  • Printed Circuit Boards (PCBs)
Automotive & Transportation — Transportation
  • Aerospace & Aviation

Product Families

Composite Materials — Prepregs & Molding Compounds
  • Laminates

Other characteristics

Brand
IsoClad
Functions
Laminate
Reinforcement Material
Glass Fibers
Markets
  • Automotive & Transportation
  • Electrical & Electronics
Benefits
  • Less Rigid than Woven Fiberglass
  • Highly Isotropic in X,Y and Z Directions
Features
  • Nonwoven Fiberglass Reinforcement
  • Low Dielectric Constant
  • Extremely Low Loss
Technology
Composite Materials
Material Features
  • Chemical Resistant
  • Dimensional Stability
  • Good Electrical Properties
  • Good Mechanical Properties
Availability

IsoClad laminates are supplied with 1/2, 1 or 2 ounce electrodeposited copper on both sides. Other copper weights and rolled copper foil are available. IsoClad is available bonded to a heavy metal ground plane. Aluminum, brass or copper plates also provide an integral heat sink and mechanical support to the substrate. When ordering IsoClad products, please specify dielectric cons t a n t , t h i c k n e s s , c l a d d i n g , p a n e l s i z e a n d a n y o t h e r s p e c i a l considerations.

Recommended Applications
  • Conformal Antennas
  • Stripline and Microstrip Circuits
  • Missile Guidance Systems
  • Radar and Electronic Wafare Systems
Composite Materials Functions
Laminate

Technical data

Table 1 of 1

21 rows
CharacteristicValueUnitMethod
Dielectric Constant at 10GHz2.17, 2.20—IPC TM-650 2.5.5.5
Surface Resistivity10 x 10^8MΩIPC TM-650 2.5.17.1
Dissipation Factor tan d, at 10 GHz0.0013—IPC TM-650 2.5.5.5
Volume Resistivity150 x 10^8MΩ-cmIPC TM-650 2.5.17.1
Thermal Coefficient of εr-157ppm/°CIPC TM-650 2.5.5.5 Adapted
Peel Strength10lb/inIPC TM-650 2.4.8
Arc Resistancemin. 180secondsASTM D-495
Tensile Modulus133, 120kpsiASTM D-638
Tensile Strength4.3, 3.8kpsiASTM D-882
Compressive Modulus182kpsiASTM D-695
Flexural Modulus213kpsiASTM D-790
Dielectric Breakdownmin. 45kVASTM D-149

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