RO4830™ Laminates
- Chemical Family
- Fluoropolymers
RO4830™ thermoset laminates are well suited for price-sensitive millimeter wave applications, such as 76-81 GHz automotive radar sensors, and are a reliable, lower cost alternative to conventional PTFE-based laminates. RO4830 laminates have a slightly higher dielectric constant of 3.2 at 77GHz, versus PTFE-woven glass laminates. LoPro® reverse treated copper foil cladding contributes to RO4830 laminates’ excellent insertion loss at 77GHZ of 2.2 db per inch.
Product families
Applications
- Printed Circuit Boards (PCBs)
- Aerospace & Aviation
Product Families
- Laminates
Other characteristics
- Brand
- RO4830
- Functions
- Laminate
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Features
RO4000® Series Thermoset Platform; Reduced Overall Cost of PCB Manufacturing versus PTFE Laminate Options; Optimized filler, Resin & Glass Composite System; Dielectric Constant at 77 GHz of 3.2; Reverse Treated Smooth LoPro® Copper Foil; Excellent Insertion Loss; Optimized Filler & Flat Glass; Good Laser Drilling Performance; Consistent Within Sheet Dielectric Constant
- Technology
- Composite Materials
- Material Features
- Chemical Resistant
- Dimensional Stability
- Good Electrical Properties
- Good Mechanical Properties
- Recommended Applications
- 76-81 GHz Automotive Radar Sensors
- Composite Materials Functions
- Laminate
Technical data
Table 1 of 1
15 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant, εr, Design | 3.24 | — | microstrip differential phase length |
| Transmission Line Loss | 2.2 | dB/in | microstrip differential phase length |
| Dissipation Factor, tan d | 0.0033 | — | split-post dielctric resonator |
| Thermal Coefficient of er (z direction) | -30 | ppm/°C | IPC-TM-650 2.5.5.5 |
| Dielectric Strength | 78.7 | kV/mm | IPC-TM-650, 2.5.6.2 |
| Water Absorption | 0.15 | % | ASTM D570 |
| Peel Strength after Thermal Stress | 0.67 | N/mm | IPC-TM-650 2.4.8 |
| Dimensional Stability (MD) | -1.8 | mm/m | IPC-TM-650 2.4.39A |
| Dimensional Stability (CMD) | -1.8 | mm/m | IPC-TM-650 2.4.39A |
| Decomposition Temperature (Td) | 408 | °C | ASTM D3850 |
| Time to Delamination (T288) | min. 30 | min | IPC-TM-650, 2.4.24.1 |
| Thermal Conductivity (calculated) | 0.45 | W/m/°K | Through-plane calculation with series mixing rule |
