RO4700™ Antenna Grade Laminates
- Chemical Family
- Fluoropolymers
RO4700™ series antenna grade laminates are a reliable alternative to the conventional PTFEbased laminates.
Product families
Applications
- Printed Circuit Boards (PCBs)
- Aerospace & Aviation
Product Families
- Laminates
Other characteristics
- Brand
- RO4700
- Functions
- Laminate
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Features
RO4700 Series Laminates - low loss dielectric with low profile foil; Reduced PIM; Low insertion loss; RO4725JXR Dk 2.55; RO4730G3 Dk 3.0 UL 94 V-0; Unique filler / closed microspheres; Low density; Light-weight 30% lighter than PTFE / Glass; Low Z-axis CTE; Design flexibility; Automated assembly compatible; Low TCDk <40 ppm/°C; Consistent circuit performance; Specially formulated thermoset resin system/filler; Low TCDk; 2.55 Dk & 3.0 Dk; Ease of fabrication; PTH process capability; Environmentally Friendly; Lead-free process compatibility; RoHS compliant
- Technology
- Composite Materials
- Material Features
- Chemical Resistant
- Dimensional Stability
- Good Electrical Properties
- Good Mechanical Properties
- HIGHLIGHTS
RO4725JXR™ and RO4730G3(TM) laminates have the mechanical and electrical properties that antenna designers need. The laminates have a dielectric constant (Dk) of 2.55 and 3.0 and a loss tangent (Df) of 0.0022 measured at 2.5 GHz when using LoPro® Reverse Treated EDC Foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with a demonstrated low PIM performance, with values better than -160 dBc (43dBm 1,900MHz signal). [2] RO4700 series antenna grade laminates are compatible with conventional epoxy and high temperature lead-free solder processing. These laminates do not require the special treatment needed on traditional PTFE-based laminates for plated through hole preparation. Lamination can be achieved using RO4400™ bondply series at 175°C. The resin systems of RO4700JXR materials are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280°C (536°F), leading to a low Z-axis CTE, excellent plated through hole reliability, and lead-free solder processability.
- Recommended Applications
- Cellular Base Station Antennas
- Composite Materials Functions
- Laminate
Technical data
Table 1 of 1
21 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant, εr, Process | 2.55 ± 0.05 | — | IPC-TM-650, 2.5.5.5 |
| Surface Resistivity | 4.8 x 10^7 | MΩ | IPC-TM-650, 2.5.17.1 |
| Dielectric Constant, εr, Design | 2.64 | — | Differential Phase Length Method |
| Volume Resistivity | 2.16 x 10^8 | MΩ-cm | IPC-TM-650, 2.5.17.1 |
| Dissipation Factor at 2.5 GHz | 0.0026 | — | IPC-TM-650, 2.5.5.5 |
| Dissipation Factor tan d, at 10 GHz | 0.0022 | — | IPC-TM-650, 2.5.5.5 |
| Thermal Coefficient of εr | 34 | ppm/°C | IPC-TM-650, 2.5.5.5 |
| PIM | -166 | dBc | 43dBm 1900MHz |
| Electrical Strength | 630 | V/mil | IPC-TM-650, 2.5.6.2 |
| Flexural Strength (MD) | 17.5 | kpsi | ASTM D790 |
| Flexural Strength (CMD) | 13.3 | kpsi | ASTM D790 |
| Dimensional Stability | max. 0.4 | mm/m | IPC-TM-650, 2.4.39A |
