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DiClad® 870880 Laminates
- Chemical Family
- Fluoropolymers
DiClad laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precise control of the fiberglass/PTFE ratio, DiClad laminates offer a range of choices from the lowest dielectric constant and dissipation factor to a more highly reinforced laminate with better dimensional stability
Product families
Applications
Electrical & Electronics — Parts & Components
- Printed Circuit Boards (PCBs)
Automotive & Transportation — Transportation
- Aerospace & Aviation
Product Families
Composite Materials — Prepregs & Molding Compounds
- Laminates
Other characteristics
- Brand
- DiClad
- Functions
- Laminate
- Reinforcement Material
- Glass Fibers
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Technology
- Composite Materials
- Material Features
- Chemical Resistant
- Dimensional Stability
- Good Electrical Properties
- Good Mechanical Properties
- Composite Materials Functions
- Laminate
Technical data
Table 1 of 1
23 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant at 10GHz | 2.17, 2.20 | — | IPC TM-650 2.5.5.5 |
| Surface Resistivity | 0.29 x 10^7 | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Constant at 1MHz | 2.17, 2.20 | — | IPC TM-650 2.5.5.3 |
| Volume Resistivity | 1.4 x 10^9 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.0009 | — | IPC TM-650 2.5.5.5 |
| Dissipation Factor at 1 GHz | 0.0008 | — | IPC TM-650 2.5.5.3 |
| Thermal Coefficient of εr | -160 | ppm/°C | IPC TM-650 2.5.5.5 Adapted |
| Peel Strength | 14 | lb/in | IPC TM-650 2.4.8 |
| Arc Resistance | min. 180 | seconds | ASTM D-495 |
| Tensile Modulus | 267, 202 | kpsi | ASTM D-638 |
| Tensile Strength | 8.1, 7.5 | kpsi | ASTM D-882 |
| Compressive Modulus | 237 | kpsi | ASTM D-695 |
