TC600™ Laminates
- Chemical Family
- Fluoropolymers
Arlon’s TC600 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate. TC600 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies. Mechanical robustness is also greatly improved for the 6.15 dielectric constant market.
Product families
- Laminates
Other characteristics
- Brand
- TC600
- Functions
- Laminate
- Reinforcement Material
- Glass Fibers
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Benefits
- Heat Dissipation and Management
- Replace Ceramic in Some Applications
- Improved Processing and Reliability
- Large Panel Sizes for Multiple Circuit
- Layout for lowered Processing Costs
- Technology
- Composite Materials
- Material Features
- Chemical Resistant
- Dimensional Stability
- Good Electrical Properties
- Good Mechanical Properties
- HIGHLIGHTS
The increased thermal conductivity of TC600 provides higher power handling, reduces hot-spots and improves device reliability. This higher heat transfer within the substrate complements designs using coins, heat sinks or thermal vias to provide designers additional design margin in managing heat. In designs with limited thermal management options, TC600 significantly improves heat transfer where the primary thermal path is through the laminate. This results in reduced in junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs. In addition, lower operating temperatures and chip-matching thermal expansion characteristics provide better reliability for component attachment prone to solder fatigue, solder softening and joint failure. TC600 has "Best-In-Class" Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. Dielectric constant stability is also critical to phase sensitive devices such as network transformers utilized for impedance matching networks utilized in power amplifier circuitry. TC600 has low Z-Direction CTE.This feature provides unsurpassed plated through hole reliability. TC600 is a "soft substrate" and irrelatively insensitive to stress from vibration. Its robust nature overcomes the brittleness of thermoset ceramic loaded hydrocarbons or ceramics (such as alumina or LTCC) through suspension of micro-dispersed ceramics in a relatively soft, woven fiberglass reinforced PTFE-based substrate. This gives RF designers the advantage of low loss, without sacrificing mechanical robustness required to fulfill the needs of shock, drop and impact testing requirements of electronics. It is preferred by board manufacturers, as it can be easily cut, drilled and routed without being sensitive to cracking.
- Availability
TC600 laminate is supplied with 1/2, 1 or 2 ounce electrodeposited or reverse treat copper on both sides. Other copper weights may be available. TC600 is available bonded to heavy metal ground planes. Aluminum, brass or copper plates also provide an integral heat sink and mechanical support to the substrate. When requesting samples of TC600 product, please specify thickness, cladding, panel size, and any other special considerations. Panel sizes cut from a master sheet include: 12" x 18", 18" X 24", 16" X 18". Contact Customer Service for other custom panel sizes.
- Recommended Applications
• Power Amplifiers, Filters and Couplers • Microwave Combiner and Power Divider Boards in Avionics Applications • Small Footprint Antennas • Digital Audio Broadcasting (DAB) Antennas (Satellite Radio) • GPS & Hand-held RFID Reader Antennas
- Composite Materials Functions
- Laminate
Technical data
Table 1 of 1
34 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Constant at 1.8 MHz | 6.15 | — | RESONANT CAVITY |
| Surface Resistivity (E24/125) | 9 x 10^8 | MΩ | IPC TM-650 2.5.17.1 |
| Dielectric Constant at 10 GHz | 6.15 | — | IPC TM-650 2.5.5.5 |
| Surface Resistivity (C96/35/90) | 3.1 x 10^9 | MΩ | IPC TM-650 2.5.17.1 |
| Dissipation Factor at 1.8 GHz | 0.0017 | — | RESONANT CAVITY |
| Volume Resistivity (E24/125) | 2.4 x 10^8 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Dissipation Factor tan d, at 10 GHz | 0.002 | — | IPC TM-650 2.5.5.5 |
| Volume Resistivity (C96/35/90) | 1.6 x 10^9 | MΩ-cm | IPC TM-650 2.5.17.1 |
| Temperature Coefficient of Dielectric - TC r at 10 GHz | -75 | ppm/°C | IPC TM-650 2.5.5.5 |
| Electrical Strength | 34 | kV/mm | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | 62 | kV | IPC TM-650 2.5.6 |
| Arc Resistance | min. 240 | seconds | IPC TM-650 2.5.1 |
