HYDRA LF
- Chemical Family
- Rosins
HYDRA LF™ (Water-Soluble Solder Paste and Tacky Paste Flux) is a versatile solution for soldering tasks, particularly stencil applications. Made from rosin, it meets REACH regulations in Europe and boasts water-soluble properties for easy cleaning.
Other characteristics
- Brand
- HYDRA
- Features
- Water Soluble
- Product Type
- Solder Paste
- Application Area
Ball Grid Array (BGA), Stencil, Surface Mount Device; Ball Grid Array (BGA); Stencil; Surface Mount Device
- Keynotes
Resin-based water-soluble REL0 (Cleaned); World-class printability, instant activity response; Suitable for OEM BGA and SMD placement; Ultra-Low voiding. Clear residue. Optimal viscosity. Excellent pin transfer. REACH-complaint; Superior dispensing or stencil printing; Sharp definition at high-speeds; Low solder balling and graping. Long stencil life; Easy to clean using IPA, solvents, water-based saponifiers, vapor degreaser or ultrasonic devices
- Printing
Optimal print definition for fine pitch applications. Long stencil life of this product virtually eliminates waste of solder paste. For mesh/size determination refer to the Pitch Requirements chart below:
- Viscosity
- * Malcom @ 10 RPM @ 25°C x10³ g/cm/s
- Availability
Hydra-LF™ - available in many alloys including: Sn42Bi58, Sn42Bi57.6Ag0.4, Sn42Bi57Ag1, Sn96.5Ag3.5, Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn99.3Cu0.7, Sn100c, Sn100cv, LF-C2
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Jars
- Syringe
- Product Families
Ready-to-Use Products — Other Ready-to-Use Products
- Printer Operations
Stencil printer does not require any specific optimization, should be fully adjustable based on standard in-house process requirements, including high-speed printers; Print Speed: 20-200 mm/sec (add pressure for speed) Squeegee Pressure: 70-540 g/cm of blade (add for speed) Stencil Vac/Wipe: Every 10-25 prints or as necessary; Automated and vacuum cleaning systems for both stencil and misprinted boards. Manual cleaning using Isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.
- Packaging Information
- Options with various viscosity and metal load for stencil printing and dispensing applications:
- Printing
- Jars, 1/4 NPT nozzle cartridges
- Dispensing
- Syringes, ProFlow cassettes
- Certifications and Compliance
- REACH (Europe)
- Ready to Use Product Features
- Water Soluble
- Shelf LIfe
Refrigerated storage at 5-7°C will prolong the solder paste shelf life to no less than 6 months. Solder Paste should be allowed to reach ambient temperature, normalize for about 6-8 hours before use. Tacky flux has 24 months shelf life stored in room temperature. Refrigeration won't extend shelf life. Normalize for 4-6 hours if stored refrigerated. Paste/flux in syringes and cartridges should be kept vertically, dispensing tip pointing down.. Note :NEVER FREEZE SOLDER PASTE / FLUX!
Technical data
Table 1 of 1
1 row| Characteristic | Value | Unit |
|---|---|---|
| Stencil Life (at 30 - 70% R/H & 20 - 25°C) | max. 16 | hours |
