HYDRA MT
- Chemical Family
- Rosins
HYDRA MT™ is a no-clean solder paste and tacky paste flux designed for stencil applications, particularly in the aerospace and defense industries. It is compliant with European REACH regulations and belongs to the rosin chemical family. Its features include excellent printability and water solubility, ensuring ease of use and high-quality results in soldering tasks.
Product families
- Other Military & Defense Applications
- Aerospace & Aviation
Other characteristics
- Brand
- HYDRA
- Features
- Excellent Printability, Water Soluble
- Product Type
- Solder Paste
- Application Area
Aerospace Applications, Chip Scale Packaging (CSP), Defense, Land Grid Array (LGA), Quad Flat No-Lead (QFN), Stencil; Aerospace Applications; Chip Scale Packaging (CSP); Defense; Land Grid Array (LGA); Quad Flat No-Lead (QFN); Stencil
- Markets
- Automotive & Transportation
- Industrial
- Keynotes
Resin-based water-soluble REL0 (Cleaned); Tier I Aerospace/Defense - ultra-low voiding; Clear residue. Optimal viscosity. Excellent pin transfer. Suitable for CSP, QFN, LGA, etc; World-class printability, instant activity response; Superior dispensing or stencil printing; Sharp definition at high-speeds; Low solder balling and graping. Long stencil life; Easy to clean using warm Deionized Water, IPA, solvents, water-based
- Printing
Optimal print definition for fine pitch applications. Long stencil life of this product virtually eliminates waste of solder paste. For mesh/size determination refer to the Pitch Requirements chart below:
- Viscosity
- * Malcom @ 10 RPM @ 25°C x10³ g/cm/s
- Availability
Hydra-MT™ - available in many alloys on request: Sn42Bi58, Sn42Bi57.6Ag0.4, Sn42Bi57Ag1, Sn43Pb43Bi14, Sn60Pb40, Sn62Pb36Ag2, Sn62.8Pb36.8Ag0.4, Sn63Pb37
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Jars
- Syringe
- Product Families
Ready-to-Use Products — Other Ready-to-Use Products
- Printer Operations
Stencil printer does not require any specific optimization, should be fully adjustable based on standard in-house process requirements, including high-speed printers; Print Speed: 20-200 mm/sec (add pressure for speed) Squeegee Pressure: 70-540 g/cm of blade (add for speed) Stencil Vac/Wipe: Every 10-25 prints or as necessary; Automated and vacuum cleaning systems for both stencil and misprinted boards. Manual cleaning using Isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.
- Packaging Information
- Options with various viscosity and metal load for stencil printing and dispensing applications:
- Printing
- Jars, 1/4 NPT nozzle cartridges
- Dispensing
- Syringes, ProFlow cassettes
- Certifications and Compliance
- REACH (Europe)
- Ready to Use Product Features
- Excellent Printability
- Water Soluble
- Shelf LIfe
Refrigerated storage at 5-7°C will prolong the solder paste shelf life to no less than 6 months. Solder Paste should be allowed to reach ambient temperature, normalize for about 6-8 hours before use. Tacky flux has 24 months shelf life stored in room temperature. Refrigeration won't extend shelf life. Normalize for 4-6 hours if stored refrigerated. Paste/flux in syringes and cartridges should be kept vertically, dispensing tip pointing down.. Note :NEVER FREEZE SOLDER PASTE / FLUX!
Technical data
Table 1 of 1
1 row| Characteristic | Value | Unit |
|---|---|---|
| Stencil Life (at 30 - 70% R/H & 20 - 25°C) | max. 12 | hours |
