HYDRA PRO MT
- Chemical Family
- Rosins
HYDRA PRO MT™ is a water-soluble solder paste and tacky paste flux primarily used for stencil applications. It falls under the rosin chemical family and meets regulatory compliance standards such as REACH in Europe. A notable feature of this product is its water solubility, offering convenience and ease of use in various soldering tasks.
Other characteristics
- Brand
- HYDRA
- Features
- Water Soluble
- Product Type
- Solder Paste
- Application Area
Ball Grid Array (BGA), Chip Scale Packaging (CSP), Land Grid Array (LGA), Quad Flat No-Lead (QFN), Stencil; Ball Grid Array (BGA); Chip Scale Packaging (CSP); Land Grid Array (LGA); Quad Flat No-Lead (QFN); Stencil
- Keynotes
Resin-based water-soluble REM1 (cleaned); World-class printing, instant response; High activity BGA, CSP, QFN, LGA; Low voiding. Clear residue. Optimal viscosity. Excellent pin transfer. REACH-complaint; Superior dispensing or stencil printing; Sharp definition at high-speeds; Low solder balling and graping. Long stencil life; Easy to clean using IPA, solvents, water-based saponifiers, vapor degreaser
- Printing
Optimal print definition for fine pitch applications. Long stencil life of this product virtually eliminates waste of solder paste. For mesh/size determination refer to the Pitch Requirements chart below:
- Viscosity
- * Malcom @ 10 RPM @ 25°C x10³ g/cm/s
- Availability
HydraPRO-MT™ - available in various alloys request: Sn42Bi58, Sn42Bi57.6Ag0.4, Sn42Bi57Ag1, Sn43Pb43Bi14, Sn60Pb40, Sn62Pb36Ag2, Sn62.8Pb36.8Ag0.4, Sn63Pb37
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Jars
- Syringe
- Product Families
Ready-to-Use Products — Other Ready-to-Use Products
- Printer Operations
Stencil printer does not require any specific optimization, should be fully adjustable based on standard in-house process requirements, including high-speed printers; Print Speed: 20-200 mm/sec (add pressure for speed) Squeegee Pressure: 70-540 g/cm of blade (add for speed) Stencil Vac/Wipe: Every 10-25 prints or as necessary; Automated and vacuum cleaning systems for both stencil and misprinted boards. Manual cleaning using Isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.
- Packaging Information
- Options with various viscosity and metal load for stencil printing and dispensing applications:
- Printing
- Jars, 1/4 NPT nozzle cartridges
- Dispensing
- Syringes, ProFlow cassettes
- Certifications and Compliance
- REACH (Europe)
- Ready to Use Product Features
- Water Soluble
- Shelf LIfe
Refrigerated storage at 5-7°C will prolong the solder paste shelf life to no less than 6 months. Solder Paste should be allowed to reach ambient temperature, normalize for about 6-8 hours before use. Tacky flux has 24 months shelf life stored in room temperature. Refrigeration won't extend shelf life. Normalize for 4-6 hours if stored refrigerated. Paste/flux in syringes and cartridges should be kept vertically, dispensing tip pointing down.. Note :NEVER FREEZE SOLDER PASTE / FLUX!
Technical data
Table 1 of 1
1 row| Characteristic | Value | Unit |
|---|---|---|
| Stencil Life (at 30 - 70% R/H & 20 - 25°C) | max. 12 | hours |
