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STIRRI ASM

Chemical Family
Rosins

STIRRI ASM™ is your go-to solution for soldering tasks. This versatile product combines the benefits of no-clean solder paste and tacky flux, offering odorless application and the reliability of rosin chemistry. Ideal for printed circuit boards, STIRRI ASM™ ensures seamless performance and professional results with every use.

Product families

Electrical & Electronics — Parts & Components
  • Printed Circuit Boards (PCBs)

Other characteristics

Brand
STIRRI
Features
Odorless
Product Type
Solder Paste
Application Area
  • Printed Circuit Boards, Soldering
  • Printed Circuit Boards
  • Soldering
Markets
Electrical & Electronics
Keynotes

Rosin-based low-activity ROL0 (No-clean).; For assembly lines / automated soldering. Odorless formulation universal for leaded or LF.; Low voiding. Clear residue. Optimal viscosity.; Sharp definition printing at high-speeds.; Instant wetting on most PCB finishes.; Mighty action, smooth flow, and excellent ability to hold components in place. Long stencil life; Sharp definition at high-speeds. Low solder balling and graping.; Easy to clean using IPA, solvents, water-based saponifiers, vapor degreaser or ultrasonic devices.

Printing

Optimal print definition for fine pitch applications. Long stencil life of this product virtually eliminates waste of solder paste. For mesh/size determination refer to the Pitch Requirements chart below:

Viscosity

* Malcom @ 10 RPM @ 25°C x10³ g/cm/s g/cm

Availability

STIRRI-ASM™ - available in many alloys: Sn42Bi58, Sn42Bi57.6Ag0.4, Sn42Bi57Ag1, Sn43Pb43Bi14, Sn60Pb40, Sn62Pb36Ag2, Sn62.8Pb36.8Ag0.4, Sn63Pb37, Sn96.5Ag3.5, Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn99.3Cu0.7, Sn100c

Technology
Ready-to-Use Products
Packaging Type
  • Cartridges
  • Jars
  • Syringe
Product Families

Ready-to-Use Products — Other Ready-to-Use Products

Printer Operations

Stencil printer does not require any specific optimization, should be fully adjustable based on standard in-house process requirements, including high-speed printers.; Print Speed: 20-200 mm/sec (add pressure for speed) Squeegee Pressure: 70-540 g/cm of blade (add for speed) Stencil Vac/Wipe: Every 10-25 prints or as necessary; Automated and vacuum cleaning systems for both stencil and misprinted boards. Manual cleaning using Isopropyl alcohol (IPA), co-solvents and/or ultrasonic scrubbers, vapor degreaser.

Packaging Information
Options with various viscosity and metal load for stencil printing and dispensing applications:
Printing
Jars, 1/4 NPT nozzle cartridges
Dispensing
Syringes, ProFlow cassettes
Ready to Use Product Features
Odorless
Shelf LIfe

Refrigerated storage at 5-7°C will prolong the solder paste shelf life to no less than 6 months. Solder Paste should be allowed to reach ambient temperature, normalize for about 6-8 hours before use. Tacky flux has 24 months shelf life stored in room temperature. Refrigeration won't extend shelf life. Normalize for 4-6 hours if stored refrigerated. Paste/flux in syringes and cartridges should be kept vertically, dispensing tip pointing down.. Note : Never freeze solder paste / flux!

Technical data

Table 1 of 1

1 row
CharacteristicValueUnit
Stencil Life (at 30 - 70% R/H & 20 - 25°C)max. 12hours

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